In Connected car news are Qualcomm, BMW, Cinemo, SmashLabs, Rear View Safety, Teradar, Soracom, Neusoft and GigaDevice.
Cinemo And SmashLabs Integrate Multi-Sensory In-Car Gaming Architecture
Cinemo has integrated SmashLabs gaming software into its scalable in-vehicle infotainment architecture, creating a multi-sensory cabin experience synchronized across lighting, haptics, audio, and climate controls. The low-latency system leverages Dolby Atmos processing and is engineered for deployment across automotive displays during stationary charging intervals or passenger transit.
The initial deployment features Smashworld: Beat Explorers, utilizing dynamic content packs licensed via Sony Music Publishing and Extreme Music. This modular software framework provides OEMs with a mechanism to differentiate connected vehicle ecosystems and expand cabin entertainment features without introducing system latency
Rear View Safety AirVue™ System Upgrade
Rear View Safety has launched an upgraded iteration of its AirVue wireless trailer safety platform, integrating advanced object-detection sensors and expanded multi-camera architecture. The enhanced system supports up to six distinct camera feeds—combining three wired and three wireless channels—to deliver comprehensive perimeter visibility and eliminate operational blind spots across commercial fleets.
Integration of proprietary Pairing-over-Power technology facilitates buttonless camera-to-monitor synchronization, streamlining drop-and-hook workflows in high-density loading environments. Complementing the optical feeds, integrated proximity backup sensors provide an eight-foot active detection range in reverse, establishing a robust sensor-fusion layer designed to mitigate collision risks for heavy commercial vehicles.
Michigan Automaker Initiates Paid Evaluation of Teradar Terahertz Vision Sensors
Boston-based perception technology startup Teradar has secured a paid, six-month technical evaluation agreement with an unnamed Michigan OEM to integrate solid-state terahertz vision hardware into future vehicle architectures. The real-world testing program focuses on vehicle integration, hardware performance, and edge-case resolution to inform the unified sensor suite for the OEM’s planned 2030 production run of Level 2 through Level 4 autonomous and ADAS-equipped platform lines.
The evaluation will assess the terahertz electromagnetic spectrum sensor as a prospective replacement or supplementary layer for legacy automotive radar and lidar systems. Specific testing parameters include urban vulnerable road user detection, small road-hazard classification, object height measurement for rideability determination, and penetration performance through vehicle fascia and bumper polymers. The solid-state THz architecture aims to resolve legacy optic degradation in zero-visibility conditions including heavy rain, snow, and dense fog.
The contract represents Teradar’s second paid OEM development project secured within the past quarter as automotive manufacturers evaluate alternative perception modalities for next-generation ADAS commercialization. Primary program outcomes will determine sub-system scalability and packaging feasibility ahead of 2030 model year sourcing deadlines.
LG Named 2026 PACE Pilot Award Finalist for UltraView Windshield Display
LG Electronics has been selected as a finalist for the 2026 Automotive News PACE Pilot Award for its UltraView Windshield Display, a next-generation in-vehicle display system designed for software-defined vehicle architectures. Engineered to address stricter eyes-on-the-road safety standards, including Euro NCAP 2026 protocols, the system consolidates vehicle telemetry, ADAS alerts, and infotainment functions into a unified optical package to streamline cockpit design.
The hardware architecture integrates a compact, focus-free augmented reality head-up display with LG’s proprietary Hover Screen technology into a single optical module. Critical driving data such as speed and navigation cues are projected into the driver’s forward field of view, while secondary functions including HVAC, media, and vehicle settings are rendered on a virtual screen at a perceived focal distance of 1.2 meters. The hybrid optical setup yields a combined field of view measuring 25 degrees by 7 degrees housed within a 15-liter physical footprint, leaving no visible black masking on the windshield when inactive.
The development targets an expanding market for advanced display interfaces as OEMs shift from multiplying individual cabin screens toward integrated optical solutions. Market research firm Omdia projects global head-up display shipments to rise from 10.21 million units in 2025 to 25.27 million units by 2032. LG is advancing pilot development with automotive partners to prepare the platform for future commercial vehicle integration.
Soracom Launches Automotive Suite for Carrier-Independent Connected Vehicle Management
Soracom, Inc. has introduced Soracom Automotive Suite, a cloud-native platform designed to streamline lifecycle connectivity management for connected vehicles across global markets. Built around GSMA SGP.32 remote SIM provisioning standards, the platform utilizes Soracom Connectivity Hypervisor software to download, configure, and switch local carrier profiles over-the-air (OTA) after vehicle deployment, maintaining fallback operational capabilities through an integrated cellular core connected to more than 500 mobile network operators.
The centralized architecture integrates multi-carrier subscription management, split-billing engines, and in-vehicle consumer data routing into a single API framework. By isolating telematics, infotainment bandwidth, and regulatory emergency voice services (eCall) using distinct Access Point Names (APNs) and traffic analysis, the suite enables OEMs to separate operational telematics overhead from end-user data monetization models while mitigating cross-border carrier lock-in over extended vehicle lifespans.
Neusoft Smart Go and GigaDevice Partner on Automotive E/E Domain Integration
Neusoft Smart Go, an intelligent vehicle connectivity subsidiary of Neusoft Corporation, has entered a strategic partnership with fabless semiconductor supplier GigaDevice to develop integrated hardware and software solutions for centralized automotive electronic and electrical architectures. The agreement focuses on optimizing GigaDevice’s automotive-grade Flash memory—which exceeds 450 million cumulative units deployed—and microcontroller units (MCUs) for integration within Neusoft’s upper-body automotive electronics, intelligent cockpit systems, central computing units, and zone controllers.
The collaboration addresses the transition toward cross-domain fusion and cockpit-driving-parking integration by aligning semiconductor manufacturing capabilities with tier-one system integration. Under the framework, the companies will execute joint chip qualification testing, establish direct supply chain contingency protocols, and accelerate the commercial deployment of AI-enabled cockpit and communications software across global OEM platforms.
Qualcomm Secures Multi-Year Compute Silicon Partnership With BMW Group for Next-Gen ADAS and Cockpit Integration
Qualcomm Technologies has secured an expanded multi-year supplier agreement with BMW Group to serve as the primary compute silicon provider across the OEM’s next-generation digital cockpit and automated driving architectures into the next decade. The multi-domain partnership leverages the full Snapdragon Digital Chassis portfolio, incorporating high-throughput SoC topologies, Snapdragon Cockpit Platforms, and dedicated Snapdragon Ride accelerators for level-specific ADAS/AD perception, localization, and motion planning workloads.
Building on the commercial deployment of the Snapdragon Ride Pilot platform within BMW’s Neue Klasse iX3 architecture, the expanded roadmap establishes a unified hardware foundation for agentic AI, centralized domain control, and software-defined vehicle execution. The silicon platform is engineered to support co-developed control loops, real-time sensor fusion processing, and scalable AI inference across upcoming high-volume vehicle programs.