Connected Car News: MIPI Alliance, Hyundai, Volvo, Green Hills, Elektrobit, LG, Google, Nexperia & Valeo

In connected care news are MIPI Alliance, Hyundai Mobis, Volvo Cars, Hyundai Motor America, AISIN, Green Hills, DP Patterning, Elektrobit, ETAS, LG Electronics, Google, GigaDevice, Tury, Motive, Polar Semiconductor, Nexperia, Silicon Motion, Zuken, Valeo

MIPI Alliance Launches Automotive SerDes Compliance Program for A-PHY Ecosystem

The MIPI Alliance has launched the MIPI A-PHY Compliance Program, establishing the industry’s first formal validation framework for an automotive serializer/deserializer standard. The program allows semiconductor manufacturers to verify that their A-PHY long-reach physical layer devices conform to standardized specifications. The initiative is structured to satisfy automotive original equipment manufacturer and Tier 1 supplier demands for multi-vendor interoperability, functional safety, and electromagnetic interference robustness within centralized software-defined vehicle compute architectures.

MIPI A-PHY serves as a standardized, long-reach physical layer interface operating up to 15 meters, enabling high-speed data transmission from vehicle image sensors and displays to autonomous driving system controllers. The compliance infrastructure is being deployed in phased intervals, with the initial phase concentrating on physical layer verification via a reference compliance test suite. Subsequent expansion phases will encompass link-layer and protocol adaptation layer testing to ensure stable data transmission for higher-layer protocols running across the MIPI Automotive SerDes Solutions end-to-end network framework.

To execute and manage the testing methodology, MIPI designated BitifEye Digital Test Solutions GmbH as the program’s first authorized test lab. BitifEye will oversee future inter-vendor plugfests and manage the official registry of A-PHY compliant hardware. Development of the verification criteria involved collaboration across component manufacturers and test equipment providers, including Keysight Technologies, Sony Semiconductor Solutions, Tektronix, Teledyne LeCroy, and Valens Semiconductor.

Hyundai Mobis Adopts Open-Source Architecture to Drive Global SDV Platform Standardization

<p”>Hyundai Mobis has joined the Software-Defined Vehicle Working Group under the Eclipse Foundation to participate in the S-Core Project, a global open-source initiative focused on standardizing foundational automotive software platforms and middleware. The S-Core Project marks the first open-source-based software development effort engineered to meet Automotive Safety Integrity Level B functional safety requirements. By shifting to a collaborative open-source development model, the Tier 1 supplier plans to publicly disclose proprietary software source code to leverage global developer input, mitigate redundant engineering investments, and establish its architecture as an industry standard.

The primary technology deployment from Hyundai Mobis involves a Linux-based container solution designed to minimize software interference within vehicle electronic control units. The partitioning framework isolates individual software applications into secure packages, enabling parallel processing speeds up to 10 times faster than legacy automotive controller technologies. Additionally, the software architecture incorporates an always-on integrity assurance function engineered to prevent cyber-attacks and external source code tampering. By introducing this container solution to the European-led project, Hyundai Mobis aims to scale platform adoption across the Asian automotive manufacturing sector.

Volvo Cars Secures US ICTS Connected Vehicle Authorization

Volvo Car AB has received specific authorization from the Office of Information and Communications Technology and Services under the Securing the Information and Communications Technology and Services Supply Chain: Connected Vehicles rule. The regulatory clearance from the US Department of Commerce permits Volvo Car USA to continue the import and sale of its connected vehicle lineup within the United States market following a comprehensive case-by-case evaluation of the OEM’s hardware and software sourcing.

The authorization follows extensive regulatory reviews regarding Volvo Cars’ corporate governance, telematics technology architecture, and data security infrastructure. The decision mitigates compliance risks associated with proposed federal restrictions on connected vehicle systems originating from specific foreign jurisdictions, ensuring uninterrupted operations for Volvo’s US growth strategy and its 1.3 billion USD Charleston, South Carolina manufacturing facility.

Hyundai Motor America Launches Dealer Mobile Service Program

Hyundai Motor America has introduced a nationwide, dealer-operated mobile service program designed to expand network repair capacity and mitigate dealership service bottlenecks caused by rising vehicle sales. Fully upfitted mobile units will deploy factory-trained technicians directly to consumer residential or corporate locations to perform routine maintenance, including oil changes, tire rotations, brake service, and over-the-air software updates.

The OEM supports participating retail partners with standardized vehicle upfitting specifications, specialized service equipment, and proprietary Dealer Management System integrations. The initiative aims to capture out-of-warranty maintenance retention, protect in-network parts revenue, and boost brand loyalty, with Hyundai targeting a fleet expansion of 150 active mobile service units across the United States network by the end of the year.

AISIN Selects Green Hills RTOS for Next-Generation Driver Monitoring Stack

AISIN Corporation has selected Green Hills Software to provide the safety-certified software foundation for its next-generation Driver Monitoring System with Alcohol Detection System. Scheduled for initial production release in 2028, the in-cabin safety platform integrates Green Hills real-time operating systems with the NXP Semiconductors i.MX 9 applications processor family and Smart Eye AI-based driver behavioral monitoring software. The combined system passively detects driver distraction, drowsiness, and alcohol impairment via image-based analytics to mitigate human-factor collision risks.

The deployment utilizes a dual-RTOS architecture running on a single system-on-chip to satisfy stringent safety partitioning. The ISO 26262 ASIL-certified INTEGRITY RTOS hosts the core camera feeds and Smart Eye AI models on the Arm Cortex-A55 cores, while the lightweight µ-velOSity RTOS executes safety-checker operations on the Cortex-M7 core. Hardware-level acceleration is driven by NXP’s integrated eIQ Neutron neural processing unit. AISIN engineering teams are using the ASIL D-certified Green Hills MULTI integrated development environment and optimizing C/C++ compilers to streamline system integration, debugging, and verification workflows.

DP Patterning Scales Flexible Electronics Production, Targets US Automotive and Aerospace Markets

Swedish flexible electronics manufacturer DP Patterning has inaugurated a new production facility in Norrköping, Sweden, establishing a production capacity of up to 10 million square meters. The expansion positions the company as Europe’s largest manufacturer of flexible electronics. Utilizing its proprietary Dry Phase Patterning technology, the company produces conductive patterned flexible electronics using a single-step, dry mechanical process that eliminates chemical etching, water waste, and sintering cycles, resulting in a reported 98% reduction in carbon dioxide emissions and energy consumption compared to conventional manufacturing methodologies.

The dry production process substitutes solid-metal base materials, such as aluminum and copper-clad aluminum, for silver-based conductive inks, mitigating supply chain volatility while delivering up to three times higher performance conductivity. DP Patterning is targeting high-volume industrial sectors including automotive, aerospace, and telecommunications. Specific automotive applications encompass battery management systems, flexible interconnects, cabin heaters, busbars, and capacitive touch sensors. The manufacturing architecture is also adaptable to a micro-plant deployment concept, allowing localized production infrastructure near customer assembly hubs.

Concurrently with the European scale-up, DP Patterning is initiating a North American market entry strategy to address regional demand for localized, sustainable supply chains in critical infrastructure. The company plans to showcase its production machinery and flexible substrates to U.S. aerospace and electronics ecosystems at upcoming industrial expositions in California, including Space Tech Expo and TechBlick.

Elektrobit and ETAS Launch Integrated Linux-Based ADAS Software Foundation at JSAE 2026

Automotive software providers Elektrobit and ETAS have introduced a fully integrated advanced driver assistance systems software foundation at the JSAE Automotive Engineering Exposition 2026 in Yokohama, Japan. The joint solution integrates EB corbos Linux for Safety Applications, a core component of Elektrobit’s software-defined vehicle platform, with the ETAS Vehicle Software Platform Suite ADAS profile. The pre-integrated operating system and middleware stack aims to reduce integration risks, development costs, and time-to-market for OEMs and Tier 1 suppliers evaluating early production vehicle programs.

The architecture provides an open-source alternative to proprietary, closed operating systems traditionally utilized within safety-critical ADAS environments. By pairing Elektrobit’s safety-enabled Linux distribution with the ETAS deterministic middleware, the platform enables Automotive Safety Integrity Level B functional safety compliance. The foundation is engineered to manage high-throughput data processing and deterministic execution requirements necessary for production-ready automated driving features, allowing function developers to scale applications uniformly across diverse vehicle lines.

This deployment highlights an industry shift toward decoupled, modular software layers within centralized automotive computing architectures. The integrated stack simplifies structural integration efforts by delivering a coordinated, single-source platform layer beneath the application software. Representatives from both companies emphasized that the validation of safety-compliant Linux paired with series-proven middleware addresses immediate automotive ecosystem demand for scalable, lower-risk infrastructure in the transition toward software-defined vehicles.

LG Electronics Unveils Multi-Display AAOS Infotainment Architecture in Collaboration With Google

LG Electronics has introduced its latest Android Automotive OS and software-defined vehicle infotainment solutions, engineered to simultaneously control multiple in-vehicle displays via a single system-on-chip. Powered by Qualcomm Technologies’ next-generation Snapdragon Cockpit Platform, the software architecture leverages resource allocation and system load optimization technology to eliminate the conventional requirement of independent control chips for each individual screen. This single-SoC integration targets reduced hardware complexity and lowered deployment costs for automotive manufacturers installing multi-display cabins.

The AAOS-based framework isolates processing for independent cabin zones, allowing parallel execution of navigation, driver telemetry, and individual passenger entertainment streams across varied screen aspect ratios. The system incorporates individualized user login profiles, parental controls, cross-screen content sharing, and an upgraded voice command interface designed to manage panoramic dashboard layouts without physical touch inputs. Recognized by Google for its stability across cluster and media domains, the multi-display platform is designed with broad chipset compatibility to ease deployment across diverse global hardware architectures.

GigaDevice Secures Automotive MCU and Analog Design Wins with Tury in Latin America

Semiconductor supplier GigaDevice has announced a broad multi-product design win and strategic partnership with automotive electronics manufacturer Tury in Brazil. The collaboration marks a significant expansion for GigaDevice within the Latin American automotive supply chain. Tury is adopting an integrated semiconductor platform from GigaDevice that spans 32-bit microcontrollers, power management integrated circuits, and analog components, allowing the tier-one supplier to consolidate component sourcing and optimize system-level architecture across multiple vehicle electronics programs.

The product deployment covers processing, power regulation, and signal conditioning across vehicle control, safety, and infotainment domains. Tury has entered final validation for the GD32C231 automotive MCU series, which is being integrated into body control and safety modules including power window lifters, electronic throttle controllers, and speed limiters. For power management, GigaDevice’s GD30LD2401 series automotive low-dropout regulators have achieved mass production, with initial shipments exceeding 30,000 units destined for aftermarket electronics modules. Additionally, GigaDevice operational amplifiers and comparators are being implemented for precision analog signal processing.

Tury’s architectural selection was driven by form-factor optimization for space-constrained automotive printed circuit boards, localized technical support from the GigaDevice Americas engineering team, and established production readiness. Executives from both companies indicated that this multi-product deployment establishes a foundation for subsequent joint development, positioning GigaDevice to compete more aggressively against incumbent semiconductor vendors in the regional automotive electronics market.

Motive Expands Physical Operations Platform with 360-Degree AI Hardware and Automated Systems Architecture

Fleet management and industrial intelligence provider Motive has announced an expansion of its hardware and software portfolio at its Vision 26 summit. The updates introduce real-time computer vision hardware, automated workflow logic, and localized AI utilities tailored for the commercial fleet sector. The systems target operational inefficiencies caused by siloed data streams and manual reporting by consolidating edge-computing hardware with predictive threat detection and automated administrative workflows.

The core hardware announcement centers on the AI Omnicam Plus system. Powered by the Qualcomm Dragonwing QCS6490 application processor, the peripheral camera array runs more than 30 concurrent computer vision models to deliver 360-degree real-time hazard detection around commercial vehicles. Concurrently, Motive upgraded its AI Dashcam Plus units with dual road-facing lenses enabling predictive collision avoidance trajectories, automated license plate recognition via a dedicated 1440p narrow field-of-view zoom lens, and localized speed sign parsing to eliminate database-dependent false speeding alerts.

On the software layer, Motive launched Atlas, an AI-driven fleet assistant capable of query-based data analysis. Atlas utilizes the Model Context Protocol to bridge telemetry logs directly into third-party enterprise tools like Claude and ChatGPT, enabling automated benchmarking tasks such as asset valuation and insurance premium analysis. The software framework integrates with a new feature set termed Automations, which executes programmed interventions—such as prompting operators to stall idling engines or ordering immediate pull-overs during critical powertrain fault code generation—independent of dispatcher monitoring.

Polar Semiconductor and Nexperia Partner on Power MOSFET Production to Secure Domestic Foundry Capacity

Pure-play wafer foundry Polar Semiconductor and discrete component manufacturer Nexperia B.V. have entered a strategic manufacturing partnership to produce next-generation power MOSFET devices. Under the agreement, Nexperia will transition its advanced power MOSFET roadmap onto Polar’s U.S.-based silicon production infrastructure. The collaboration aims to secure localized, reliable production capacity and stabilize the global supply chain amid surging semiconductor demand within AI server infrastructure, robotics, industrial automation, and automotive electronics.

The manufacturing operations will be centered at Polar’s high-volume fabrication facility in Bloomington, Minnesota. Polar will leverage its established BCD, BiCMOS, and high-voltage process technologies to manufacture Nexperia’s multi-voltage class MOSFET portfolio. As an IATF 16949-certified foundry with more than 25 years of automotive electronics experience, Polar’s zero-defect production frameworks will support Nexperia’s stringent reliability requirements for demanding power-switching applications, matching advanced copper-clip packaging tech such as LFPAK, CCPAK, and MLPAK layouts.

This foundry alliance coincides with ongoing capital investment and facility expansion at Polar’s Minnesota site to boost domestic power semiconductor manufacturing capabilities. Executives from both companies noted that the multi-year agreement validates Polar’s strategy to operate a highly differentiated, sovereign wafer foundry focused strictly on power, sensor, and high-voltage architectures. Concurrently, the deal provides Nexperia with a resilient U.S. manufacturing footprint to safeguard its long-term supply chain and support downstream customers against regional logistical disruptions.

Silicon Motion Showcases Next-Generation Storage Architectures for AI Stack at COMPUTEX 2026

NAND flash controller designer Silicon Motion Technology Corporation has announced its technology portfolio for COMPUTEX 2026, highlighting next-generation storage architectures optimized for Edge AI, Physical AI, and AI Factory workloads. As AI data processing shifts toward decentralized edge inference and data center high-capacity storage nodes, the company is deploying specialized controller platforms engineered for high-throughput data movement, reduced command latency, and sustained endurance across five distinct product divisions.

For client processing and Edge AI applications, Silicon Motion will demonstrate its PCIe Gen5 SSD controller lineup, including the SM2524XT and SM2504XT DRAMless architectures optimized for hardware-constrained AI PCs and Key-Value (KV) caching, alongside its flagship SM2508 controller. In the mobile and embedded edge intelligence sectors, the company is introducing the SM2755 UFS 4.1 and SM2738 eMMC 5.1 controllers, which prioritize low-latency access and reduced thermal dissipation profiles for continuous on-device machine learning operations.

To support high-capacity AI Factories and cloud data infrastructure, Silicon Motion will exhibit its enterprise controller portfolio, spearheaded by the new PCIe Gen6 SM8466 controller, the PCIe Gen5 SM8366 platform, and the high-density Nearline SM8388 controller. These data center processors are complemented by safety-critical hardware lines: enterprise PCIe NVMe boot drive solutions tailored for distributed data processing units (DPUs) and network nodes, and the Ferri automotive storage family, which complies with IATF-standardized AEC-Q100, ISO 26262 ASIL, ISO 21434, and ASPICE certifications for autonomous vehicles and physical AI environments.