In connected car news are Mitsubishi Electric, Murata, AEye, NASTF, Cadence, Aeva, Nissan, Red Hat, Netradyne, Domino’s, Indie Semiconductor, Ams OSRAM, Sylux, Denso, LG Display, Keysight, Seoul Semiconductor and INRIX.
In this Article
Mitsubishi Electric to Sample Fifth-Generation SiC-MOSFET Bare Dies for xEVs
Mitsubishi Electric announced it will begin shipping samples of two new fifth-generation silicon carbide metal-oxide-semiconductor field-effect transistors in bare die form in late June. The new power semiconductors are designed for integration into drive motor inverters and eAxles for electric vehicles, plug-in hybrids, and other electrified vehicle platforms.
The fifth-generation chips utilize a proprietary trench gate structure to achieve an industry-leading low on-resistance, reducing resistance by approximately 25% compared to existing Mitsubishi Electric products. This manufacturing process technology is engineered to suppress performance degradation, stabilize power loss fluctuations, and minimize long-term on-resistance variance to improve power efficiency, powertrain miniaturization, and range extension in xEV applications.
Murata Debuts Automotive Soft-Termination MLCC With Highest 100V Capacitance in 0805 Size
Murata Manufacturing introduced the GCJ21BD72A225KE02, a soft-termination chip multilayer ceramic capacitor developed for automotive powertrain and safety applications. The component achieves a capacitance of 2.2μF at a 100Vdc rating within a 0805-inch footprint, marking a first for this combination of specifications. The product targets the space constraints and electrical demands of 48V vehicle architectures, autonomous driving platforms, and advanced driver-assistance systems.
Leveraging proprietary ceramic material engineering with fine particle uniformity, the MLCC delivers a 51% reduction in board mounting area compared to previous 1206-inch offerings with equivalent capacitance and voltage ratings. The soft-termination construction mitigates mechanical stress from board flexure, vibration, and thermal cycling to reduce post-mount cracking. The automotive-grade component operates across a temperature range of -55°C to +125°C and conforms to EIA X7T temperature characteristics.
AEye Partners With MDOT for Physical AI Traffic Intelligence at ITS America
AEye announced a partnership with the Michigan Department of Transportation to showcase a live Intelligent Transportation Systems deployment at ITS America 2026 in Detroit. The demonstration features AEye’s OPTIS platform, which integrates software-defined lidar with real-time infrastructure to monitor roadway safety, traffic operations, and situational awareness across urban intersections and highway corridors.
The end-to-end system combines AEye’s Apollo software-defined lidar, Flasheye perception software, and Blue Band’s Integrator-AI solution to process long-range, real-time 3D perception data into actionable traffic intelligence. The collaborative deployment aims to transition traditional transportation infrastructure from passive monitoring to intelligent systems capable of real-time perception and automated response.
NASTF SDRM Protocol Hardens Vehicle Security Infrastructure Against Electronic Theft
The National Automotive Service Task Force is scaling its Secure Data Release Model to counter sophisticated electronic theft methods targeting diagnostic and programming interfaces. The SDRM framework functions as a vetted gateway for the Vehicle Security Professional Registry, restricting access to immobilizer and key programming data to credentialed entities. By integrating business validation, criminal background checks, and real-time transaction monitoring, NASTF ensures that advanced diagnostic capabilities remain restricted to qualified repair and recovery professionals.
Market adoption has facilitated over 471,000 secure transactions annually, with aftermarket tool manufacturers reporting zero associated theft incidents following SDRM integration. The model utilizes a dual-focus risk assessment evaluating both the operator and the diagnostic hardware to prevent the repurposing of professional repair tools for criminal activity. As automotive architectures transition toward software-defined vehicle environments, NASTF maintains technical coordination with law enforcement and tool OEMs to preserve the integrity of the secure access ecosystem.
Cadence and Aeva Partner to Accelerate 4D LiDAR Perception
Cadence Design Systems has announced that Aeva has licensed the Cadence Tensilica Vision DSP IP to enhance signal processing for its next-generation 4D LiDAR systems. Unlike traditional LiDAR, Aeva technology detects both position and velocity simultaneously, providing a more comprehensive data set for autonomous decision-making. The integration of Tensilica Vision DSPs allows Aeva to achieve high-performance, low-latency signal processing essential for real-time automotive and industrial robotics applications.
Using the Tensilica Instruction Extension language, Aeva can customize the hardware to meet specific processing needs, ensuring a more flexible and scalable LiDAR pipeline. The low-power architecture of the Tensilica DSP is optimized for Physical AI at the edge, where maintaining high throughput within a limited power budget is critical. Aeva will also leverage Cadence NeuroWeave SDK and optimized libraries for neural networks and point cloud processing to bring advanced sensing solutions to market faster.
Nissan Anchors Next-Generation SDV Platform On Red Hat In-Vehicle Operating System
Nissan Motor Co. has selected the Red Hat In-Vehicle Operating System as the foundational Linux layer for its Scalable Open Software Platform. This strategic collaboration aims to transition Nissan from hardware-locked legacy systems to a cloud-native, software-defined vehicle architecture centered on a high-performance central vehicle computer. The integration decouples application development from underlying hardware, enabling Nissan to execute vehicle feature updates with smartphone-like agility while maintaining automotive safety standards.
The joint engineering initiative focuses on an AI-native architecture designed to streamline validation cycles and increase developer productivity across Nissan’s global fleet. By leveraging a standardized open-source foundation, Nissan intends to maintain the technical depth required for mission-critical platforms over multi-decade lifecycles. This integrated development model embeds Red Hat engineering talent directly into Nissan’s pipeline to eliminate traditional systems integration friction and provide greater control over the total software stack.
Nissan Selects Red Hat for Next-Gen Central Vehicle Computer
Nissan Motor Co. has announced a strategic collaboration with Red Hat to integrate the Red Hat In-Vehicle Operating System as the foundation for its next-generation software-defined vehicle (SDV) platform. This move transitions Nissan toward a standardized, Linux-based architecture for its Scalable Open Software Platform, enabling cloud-native development and decoupling vehicle applications from specific hardware. By moving away from legacy, hardware-locked systems, Nissan can manage its vehicles’ software lifecycles more effectively over several decades.
The initiative leverages open-source leadership to create an AI-native infrastructure, streamlining validation cycles and improving developer productivity. By embedding Red Hat’s engineering expertise directly into Nissan’s development pipeline, the partnership aims to reduce system integration friction and accelerate the delivery of new features. This standardized platform allows Nissan to maintain greater control over its software stack, providing the agility to scale innovation across its global fleet while meeting rigorous safety and performance requirements.
Netradyne Expands AI Safety Footprint Across Domino’s Franchise Network
Netradyne has announced accelerated adoption of its AI-powered video safety platform across the Domino’s franchise network, with more than 1,000 delivery vehicles now utilizing Driver•i technology. Early adopter RPM Pizza reported a 66% reduction in at-fault crashes and a 24% decrease in distracted driving incidents after deploying 600 dual-facing D-215 units. The implementation leverages Netradyne’s full fleet management suite, integrating fuel tracking and preventative maintenance to mitigate an estimated $2 million in annual loss exposure while maintaining a high GreenZone safety score of 973.
To accommodate the high volume of personal vehicle use in delivery operations, Netradyne developed the FlexMount system, a specialized suction-cup mounting solution that enables tool-free hardware installation and removal. This innovation reduces deployment friction for non-owned assets while maintaining full ADAS and behavioral monitoring capabilities. Through a strategic partnership with the Domino’s Franchise Association, Netradyne is providing standardized access to its computer vision edge-processing and telematics suite, enabling franchise operators to achieve zero-incident quarters through real-time driver coaching and high-density data analytics.
Indie Semiconductor Expands Multimodal Portfolio With Ams OSRAM Image Sensor Acquisition
Indie Semiconductor has entered a definitive agreement to acquire the fabless CMOS image sensor group from ams OSRAM for 40 million euros. The transaction integrates intelligent, high-performance CMOS imaging assets and IP located in Belgium and Portugal into indie’s existing ADAS sensing architecture. By combining these imagers with proprietary sensor-fusion hardware and perception software, indie aims to enhance its multimodal capabilities across radar, LiDAR, and ultrasonic platforms, targeting the rapidly expanding physical AI and industrial automation sectors.
The acquisition is valued at a 35 million euro cash payment at closing with an additional 5 million euro vendor debt note. This strategic carve-out is designed to capture a larger share of an image sensor market projected to exceed $40 billion by 2030, driven by escalating safety regulations and the rise of humanoid robotics and cobots. The deal is expected to close in Q3 2026, subject to regulatory approval, and is positioned to be immediately accretive by strengthening indie’s portfolio of GaN SLED light-source solutions and low-latency vision systems.
Sylux Showcases Production-Ready Automotive Infrared Sensing and AI Stack at Computex 2026
Sylux, a Tier One automotive supplier and wholly owned subsidiary of Compal Electronics, demonstrated its production-ready infrared perception architecture at Computex 2026 at booth M0804. The demonstration featured the company’s Core and Plus thermal camera hardware running its proprietary CDAT (Classification, Distance, Action, Tracking) software stack. The integrated edge AI platform executes localized real-time object tracking and classification of vulnerable road users, pedestrians, and surrounding vehicles under zero-light, night-driving, and degraded meteorological conditions where conventional optical sensors and radar arrays experience performance degradation.
The software-defined vision platform is engineered for low-power edge compute deployment within advanced driver assistance systems (ADAS) frameworks to meet tightening international vehicle safety standards. The system provides the foundational sensing capabilities required for Forward Collision Warning (FCW) and Pedestrian Automatic Emergency Braking (PAEB), establishing direct compliance alignment with the Federal Motor Vehicle Safety Standard (FMVSS 127) mandate for nighttime automatic emergency braking performance. Sylux utilizes digital twin modeling and hardware-in-the-loop simulation workflows to accelerate validation timelines across its scalable hardware portfolio, which includes the Core, Plus, and Prime thermal camera variants tailored for diverse automaker integration requirements.
Denso to Showcase MobiQ V2X Infrastructure at ITS America 2026
Denso Products and Services Americas announced it will demonstrate its latest vehicle-to-everything (V2X) and intelligent transportation systems (ITS) technologies at the 2026 ITS America Conference & Expo in Detroit. Operating under its smart mobility brand, MobiQ, the Tier 1 supplier aims to showcase hardware and software integration designed to connect intersections and optimize traffic ecosystems.
The hardware display features the RSU-5941 Kit, Denso’s newest roadside unit engineering solution designed to interface directly with existing municipal traffic management systems and legacy infrastructure. Alongside the RSU, the supplier will demonstrate on-board units (OBUs) to establish synchronous vehicle-to-infrastructure (V2I) and vehicle-to-vehicle (V2V) communication pathways.
According to the company, the integrated MobiQ ecosystem is optimized to support critical ITS edge applications, including emergency vehicle preemption, traffic signal priority (TSP), and localized traveler information messaging. These deployment-ready V2X solutions focus on mitigating intersection congestion, reducing transit delays, and lowering accident rates through real-time data orchestration.
LG Display Secures ASPICE Capability Level 2 Certification to Anchor SDV Cockpit Strategy
LG Display achieved Automotive SPICE Capability Level 2 certification from the international auditing body C&BIS, validating its software development processes and quality management architectures for automotive electronic components. The tier-one supplier obtained the qualification by embedding proprietary self-diagnostic and control software algorithms directly into its next-generation instrument clusters and center fascia display modules. This milestone marks an ongoing operational pivot as cockpit displays transition from static, hardware-reliant information panels into dynamic software platforms managing centralized vehicle telemetry, safety-critical alerts, and user infotainment subsystems.
The implementation of ASPICE compliance frameworks underscores the industry-wide consolidation of electronic control units within emerging software-defined vehicle architectures, where software failure risks trigger extensive recall exposure. The Level 2 designation verifies that LG Display maintains institutionalized, repeatable engineering processes across the entire software development lifecycle to systematically prevent code defects. This credential follows the supplier’s December validation under the ISO/SAE 21434 automotive cybersecurity engineering standard, establishing a dual-layer software assurance portfolio designed to accelerate procurement pipelines with premium OEMs across the North American and European markets.
Keysight Secures Hybrid eCall Certification for EN 18052:2025
Keysight Technologies has achieved DEKRA validation for its Hybrid eCall test solution in accordance with the EN 18052:2025 standard. This certification provides automotive OEMs with a verified framework to de-risk the integration of Next-Generation eCall (NG-eCall) systems as global cellular infrastructure transitions from legacy 2G/3G to packet-switched 4G/5G environments.
The validation covers the end-to-end safety ecosystem, including In-Vehicle Systems (IVS), mobile networks, and Public Safety Answering Points (PSAPs). Key testing capabilities include performance verification of emergency call setup, Minimum Set of Data (MSD) transmission, voice quality, and network fallback mechanisms. This milestone expands upon Keysight’s existing EN 17240 validation, facilitating compliance with shifting international safety regulations.
Keysight will demonstrate these hybrid testing capabilities at the upcoming ETSI NG-eCall Plugtests 2026. The integration of this solution into automotive development pipelines is intended to reduce compliance bottlenecks and accelerate time-to-market for software-defined vehicles requiring reliable emergency connectivity across heterogeneous network infrastructures.
New HRL Lab Sensor
HRL Laboratories announced the commercial availability of the AXI-R100, a palm-sized inertial measurement unit leveraging silicon micro-electro-mechanical systems technology. The newly developed sensor achieves near navigation-grade accuracy within a reduced physical footprint compared to conventional equivalent components, positioning it for integration into global positioning system-contested navigation, autonomous driving platforms, defense systems, and aerospace applications.
The AXI-R100 utilizes the proprietary DRaGon micro-electro-mechanical systems gyroscope architecture, combining custom hardware designs with novel control firmware and calibration algorithms. This engineering approach enables the sensor to exceed current tactical-grade performance benchmarks while maintaining compatibility with wafer-scale foundry fabrication processes. Consequently, the manufacturing methodology supports high-volume automotive production demands at reduced price points.
Designed to withstand rigorous environmental stressors, the unit has undergone validation testing for vibration, shock, and thermal fluctuations common to commercial automotive and defense operations. HRL Laboratories is debuting the technical specifications of the pre-production hardware at the 2026 Joint Navigation Conference.
“`html
Seoul Semiconductor Scaled to Mass Production with Top Four Global Automakers via 12V High-Voltage Opto-Semiconductor Technology
Seoul Semiconductor Co., Ltd. initiated mass production of its proprietary High Voltage opto-semiconductor architecture with four tier-one global automotive brands across North America, Europe, and Asia, with roadmap integration targeting 10 production models by year-end. The solid-state technology shifts optoelectronic packaging from conventional 3V single-die architectures to a specialized 12V single-chip multi-junction P-N junction topology. When integrated with high-voltage driver infrastructure, the system yields a 20% reduction in driver-related bill-of-materials costs and slashes overall power consumption by approximately 10% across hybrid and battery electric vehicle sub-systems.
The core innovation optimizes power electronics topologies in high-voltage vehicle architectures utilizing 300V battery packs. Traditional 3V LED configurations require intensive 1/100 voltage step-down ratios, driving up conversion thermal losses, PCB footprint requirements, and component count. By stepping up native chip operation to 12V and leveraging scalable 30V high-voltage chip modules, the conversion delta is minimized to a 1/10 ratio, which streamlines circuit design, reduces parasitic thermal dissipation, and enhances overall component durability. The rollout is insulated by a robust intellectual property portfolio encompassing hundreds of high-voltage opto-semiconductor and over 50 discrete driver patents.
The technical deployment positions the supplier to capture expanding hardware-per-vehicle values, which are projected to grow from $100 to $200 amid increasing premium lighting and vehicle-to-everything communication demands. Backed by International Energy Agency projections indicating hybrid and electric vehicle market penetration will eclipse 40% globally by 2030, Seoul Semiconductor is accelerating its commercial pipeline to transition its automotive business division into the corporation’s primary revenue driver while securing market penetration within the top 10 global automotive manufacturing groups.
INRIX Expands Predictive Parking and Curb Intelligence Platform Across Global Markets
INRIX, Inc. has announced an expanded deployment of its predictive parking and curb intelligence platform, scaling its global database to encompass 48 million parking spaces across 7 million locations in 22,000 cities and 145 countries. Designed for integration into automotive OEM navigation systems, mapping platforms, and smart city infrastructure, the data architecture captures 500,000 digitized on-street segments. The intelligence layer processes 44 billion daily data points harvested from a connected fleet network of 300 million vehicles and mobile devices to build dynamic, probabilistic predictive models.
The software-defined platform shifts from static location indexing to dynamic predictive availability modeling at a vehicle’s estimated time of arrival (ETA). Utilizing cloud-based AI pipelines, the system generates real-time updates in 15-minute intervals and forecasts parking demand trends up to seven days in advance. The spatial data framework integrates complex curb-level metrics including dynamic pricing structures, hyper-local parking restrictions, and structural curb usage patterns, while actively filtering out restricted or inaccessible spaces from driver-facing inventory to optimize route planning.
To maintain algorithmic reliability, INRIX employs a data quality framework targeting a 95% statistical confidence level and a ±5% margin of error via randomized urban sampling. The company executes monthly benchmark testing leveraging high-resolution satellite imagery, public APIs, and municipal telemetry, alongside quarterly physical ground-truth validation. In quality audits conducted from January through April 2026 across 46 municipal nodes—including Tier One dense urban environments such as Los Angeles, San Diego, Boston, London, and Berlin—the telemetry platform demonstrated approximately 99% accuracy in physical coverage and core attribute attribution.