$50M for Wheels
Micro mobility company Wheels announced a funding round of more than $50 Million led by DBL Partners.
Wind River Certified
Wind River, a leader in delivering software for the intelligent edge, announced that certification authority TÜV SÜD has endorsed an ISO 26262 ASIL-D certification program for its AUTOSAR Adaptive software platform. The software provides a foundation for a next-generation advanced driver assistance system (ADAS) and autonomous driving systems. The safety certification process is currently underway.
The certification-ready software platform is architected to support the highest levels of safety and leverage the power of the underlying operating environments, such as the VxWorks® real-time operating system (RTOS) or Wind River Linux, to provide a flexible and extensible services-oriented architecture for advanced connected and autonomous vehicle applications. This AUTOSAR Adaptive software platform offers portability of applications and algorithms across any target environment, allowing compute to be placed where it is most productive for the performance of the overall system. The platform will also deliver a path to the component and system-level safety necessary to deliver confidence at higher levels of vehicle autonomy.
AUTOSAR standards frameworks, both the Classic Platform and Adaptive Platform, provide a standardization of basic system functions and functional interfaces. Given the demanding compute needs of connected and autonomous cars, AUTOSAR Adaptive–based platforms are designed for service-oriented architecture and intended for high-performance computing electronic control units (ECUs). For example, AUTOSAR Adaptive systems could provide a standardized software framework for sensor fusion data processing, over-the-air (OTA) updates, and vehicle-to-infrastructure or IoT features.
NXP & Synopsys
Synopsys, Inc. announced that NXP, the world leader in secure connectivity solutions for embedded applications, plans to deploy Synopsys’ native automotive design solutions to improve quality-of-results (QoR) and time-to-results (TTR) for its next-generation, safety-critical system-on-chip (SoC) designs. The accelerating evolution of vehicle technologies means that more automotive chips are required to satisfy higher automotive safety integrity levels (ASILs) for autonomous driving and advanced driver-assistance systems (ADAS). To meet higher ASILs, functional safety mechanisms, such as triple-mode redundancy (TMR) and dual-core lock-step (DCLS), can be used. These mechanisms mitigate random hardware failures in automotive designs, such as single-event upsets (SEUs), but can present TTR, capacity, and QoR design challenges which can be significantly alleviated using Synopsys’ native automotive design solutions.
Synopsys, Inc. announced its new native automotive solutions for more efficient system-on-chip (SoC) design. The accelerating evolution of vehicle technologies means that more automotive chips are required to satisfy higher automotive safety integrity levels (ASILs) for autonomous driving and advanced driver-assistance systems (ADAS). Synopsys’ native automotive design solutions enable designers to achieve their target ASILs by providing the industry’s most comprehensive feature set to implement functional safety (FuSa) mechanisms, such as triple-mode redundancy (TMR), dual-core lock-step (DCLS), and failsafe finite state machine (FSM).
With the differentiation available through native automotive solutions, designers can generate the industry’s first FuSa intent early in the design flow to describe safety mechanism behavior, which is used as input and maintained throughout the digital design flow. Synopsys’ native automotive solutions comprise a complete digital design flow incorporating FuSa-enabled technologies, which work together to maximize efficiency. These technologies include:
- TestMAX FuSa performs early functional-safety analysis at RTL- or gate-level and identifies candidates for TMR or DCLS redundancy to achieve single-point fault metric (SPFM) goals for target ASIL
- Design Compiler® NXT synthesis, IC Compiler™ II place-and-route, and Fusion Compiler™ design insert, check, and report the safety mechanisms implemented
- Formality® equivalence checker functionally verifies that the RTL matches the netlist after redundancy or additional logic modules are inserted
- IC Validator physical signoff verifies the layout and reports that all redundancy mechanisms are correctly implemented
Renesas R-Car Consortium
Renesas Electronics Corporation announced the launch of its R-Car Consortium Proactive Partner Program. The program adds a new level to Renesas’ current R-Car Consortium, enabling customers to quickly identify and engage with the partners whose solutions will help them accelerate their innovation for the future mobility market.
The Proactive Partner Program’s open platform approach creates a flexible and diverse development environment for system developers. Access to advanced technologies and solutions enable users to address and overcome their unique development challenges. A global automotive semiconductor leader, Renesas has a long history delivering reliable and innovative automotive solutions for a wide range of systems.
ATP New NAND
ATP Electronics, the leading manufacturer of “Industrial Only” memory and storage solutions, has announced the launch of S600Sia, its first 3D triple-level cell (TLC) flash-based A1 Performance Class SD and microSD cards built for industrial and automotive applications.
ATP employs 64-layer 3D NAND technology, which is standing out to become the mainstream of the automotive and industrial market with steady supply for 5 years. By scaling vertically, 3D NAND mitigates reliability concerns that came with planar NAND’s shrinking lithography.
Sumitomo & TomTom
Sumitomo Electric Industries, Ltd. and TomTom, today announced a collaboration utilizing Sumitomo Electric’s expertise in intelligent transport systems and TomTom’s highly accurate real-time traffic data and high definition maps. Working together, the companies will create mobility solutions designed to improve road safety and traffic congestion.
TomTom & ChargeHub
Location technology specialist, TomTom (TOM2), announced an agreement with ChargeHub, a leading aggregator and digital platform for public electrical vehicle charging stations (EVS). ChargeHub will provide TomTom with access to one of the largest databases of public charging stations in North America, bringing the total global number of charging stations integrated with TomTom’s maps to more than 300,000
Qt Co–Awarded by F&S
Based on its recent analysis of the global automotive User Interface/User Experience (UI/UX) market, Frost & Sullivan recognizes The Qt Company with the 2019 Global Customer Value Leadership Award. Responding to the rising demand for UIs, performance, and intelligence in next-generation automobile models, The Qt Company rolled out a series of high-performance software solutions including Qt Automotive Suite, Qt Safe Renderer, Qt Design Studio, and Qt for Python. Its collaboration model with industry players, coupled with customer engagement, has allowed it to focus on continuous development, provide superior products with quality performance, and ultimately, present unrivaled customer value.
Darlema New Auto Engine
Startup company, Darlema Corp unveils new automobile engine called the CWPSC (Combustion with Pre-Stage Compression) that doubles gas mileage and reduces carbon emissions by 50%. This new spark ignition engine achieves efficiency rating of 53-57% at the vehicle wheel, uses conventional fuels, doesn’t have a throttle and does not use a turbo.
Samsung ANSYS MDI
Samsung Foundry certified ANSYS multiphysics simulation solutions for its latest multi-die integration (MDI) advanced two and a half dimensional/three-dimensional integrated circuit (2.5D/3D-IC) packaging technology. The certification empowers mutual customers to achieve higher performance and lower power within a smaller form factor when designing 2.5/3D-ICs for artificial intelligence (AI), 5G, automotive, networking and high-performance computing (HPC) applications.
System-in-Package designs — enabled by Samsung MDI — are highly complex with multiple dies integrated on an interposer in a 2.5D/3D packaging configuration. MDI flow combines analysis, implementation and physical verification in a single canvas and uniquely features early-stage system-level pathfinding and complex multiphysics signoff capabilities. These designs are widely used in AI, 5G, automotive, high-speed networking and HPC applications to achieve extreme system bandwidth, low latency and high performance. ANSYS multiphysics simulation solutions for MDI signoff offer a complete 2.5D/3D-IC methodology for power, signal and thermal integrity and reliability analysis across the broad frequency spectrum of chip, package and board and system design to improve engineering efficiency, achieve simulation accuracy and accelerate time-to-results.
Samsung Foundry certifies ANSYS Icepak and ANSYS RedHawk family of solutions for power, signal and thermal integrity and reliability analyses. The certification allows for detailed modeling of silicon interposer, through silicon vias, microbumps, high-bandwidth memory, high-speed interfaces and different dies, which is critical for accurately simulating power, signal and thermal integrity effects.
Cadence Design Systems, Inc. announced that Samsung Foundry certified a new Cadence® reference flow for the creation of advanced-node automotive designs. Cadence and Samsung Foundry collaborated on the development of the reference design, which was validated using the Samsung Foundry 8nm Low-Power Plus (8LPP) process technology. The certified flow is available on a wide range of Samsung Foundry nodes and includes the Cadence digital implementation and signoff, verification and custom IC design suites, offering customers optimal power, performance and area (PPA) and a faster path to achieving automotive system-on-chip (SoC) safety, quality and reliability targets. For more information, customers can contact Samsung Foundry.
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