In connected care news are VicOne, CYMETRIS, NICB, Honk, LexisNexis, IMS, IonQ, SDT, OMNIVISION, ATLANT 3D, UC Berkeley, OSCP, IonQ, Cadence and Kigen.
VicOne & CYMETRIS Link Vulnerability Intelligence
Automotive cybersecurity provider VicOne and risk engineering platform CYMETRIS have integrated VicOne’s xZETA vulnerability intelligence with CYMETRIS’s risk-modeling platform. The two-way connection automates continuous threat analysis and risk assessment, tying known software vulnerabilities and software bills of materials directly to vehicle electronic control units, attack paths, and system architectures.
Through an automated API bridge, xZETA feeds prioritized vulnerability data, ranked by VicOne’s own impact rating and Trend Micro Zero Day Initiative intelligence, into active CYMETRIS projects. Vehicle architecture details flow back the other way, helping automakers and Tier-1 suppliers judge whether existing controls can be bypassed, model those bypass scenarios, and keep auditable evidence for ISO/SAE 21434 and UN R155 compliance.
NICB and Honk Fight Predatory Towing
The National Insurance Crime Bureau has partnered with roadside platform Honk Technologies to share intelligence on illicit practices in towing, impound, storage, and salvage. Combining Honk’s real-time service data with NICB’s multi-carrier investigative network should speed the detection of predatory billing and staged roadside incidents.
Honk links fleets, carriers, and motorists to towing networks through digital dispatch, which gives it detailed geographic and transaction-level data. Anomalies and emerging fraud patterns spotted on the platform will feed into NICB’s data consortium and reach law enforcement and insurer investigators, with the aim of reducing the severity of claims.
LexisNexis and IMS Driving Scores on Phones
LexisNexis Risk Solutions and IMS have built the LexisNexis Drive Metrics scoring engine into IMS’s EdgeSDK mobile development kit. Instead of processing smartphone telematics in the cloud, the system runs the calculations on the device, so auto insurers can launch usage-based programs without heavy cloud ingestion and storage costs.
Computing driver-behavior scores locally is designed to cut program operating costs by 50 to 80 percent and ease consumer data privacy concerns. Carriers can embed the software in their own apps or use an IMS white-label interface, and the resulting risk scores correlate with existing LexisNexis telematics datasets for underwriting, rate filing, and claims.
IonQ and SDT Quantum Hardware in South Korea
IonQ has signed a multi-year partnership with Seoul-based SDT Inc. to supply an IonQ Superion 256 quantum computer along with silicon-vacancy quantum memory modules. The system is destined for an SDT commercial customer in South Korea and will support hybrid quantum-classical data centers and biomedical research.
SDT will also set up a manufacturing and system integration facility in Gumi to handle packaging, assembly, and commissioning of IonQ’s memory modules and complete platforms. The deal widens IonQ’s regional supply chain and builds on its existing work with Hyundai Motor Company, SK Telecom, and KISTI.
OMNIVISION: Low-Power Chip for Parking Surveillance
OMNIVISION has announced the OAX7700, an always-on vision AI companion chip meant to turn a car’s exterior cameras, including surround-view systems, into continuous parking monitors. A built-in neural processing unit handles human detection, object classification, and distance estimation at the edge, using up to 97 percent less power than existing automotive surveillance approaches.
In standby, the chip keeps a rolling buffer of five to ten seconds of video and starts full recording only when it detects an event, which cuts false alarms and spares the vehicle’s central controllers. It supports over-the-air algorithm updates for software-defined vehicles, comes in a 5.5 mm by 3.5 mm 60-pin package, and is scheduled for volume production in the first quarter of 2027.
ATLANT 3D and UC Berkeley Plan an Atomic-Scale Materials Hub
ATLANT 3D and the University of California, Berkeley have signed a memorandum of understanding to explore A-HUB California, facilitated by the Berkeley Emerging Technologies Research Center. Modeled on ATLANT 3D’s Copenhagen facility, the hub would work as an autonomous materials foundry, combining AI, atomic-precision fabrication, and closed-loop validation to turn new solid-state materials into working electronics.
The technical core is ATLANT 3D’s Direct Atomic Layer Processing technology and NANOFABRICATOR platform, which deposit material selectively at the atomic scale straight onto target substrates. By tying predictive algorithms to direct synthesis, the partners aim to remove validation bottlenecks in device fabrication, materials synthesis, and process testing, while co-developing machine-learning design pipelines, rapid prototyping, and workforce training for semiconductors and microelectronics.
OSCP Open-Source ROS 2 Driver for Its MK2 Sensors
OSCP Motion Sensing has released an open-source ROS 2 driver under the MIT license for its MK2 inertial measurement units, unveiled at ROSCon Global in Toronto. It supports the Humble and Jazzy distributions on Ubuntu 22.04 and 24.04, communicates over RS-422 or CAN-FD, and publishes to standard sensor message topics so developers can skip custom protocol parsing. Three modular packages cover node execution, decoding, and custom timestamped messages, with configurable services for bias calibration, orientation reset, and magnetometer calibration.
One driver works across the product line, from the all-MEMS MK2M2 to the hybrid MK2E2, which adds a photonic gyroscope on the Z-axis to limit drift where GNSS is unavailable. In a 21-minute urban test without satellite positioning, that configuration cut final drift from 20.5 meters to 5.7 meters and avoided the vibration sensitivity of mechanical designs. The driver will also support the upcoming MK2Z optical gyroscope prototype, aimed at tunnels, underground sites, and industrial robots needing 0.005 degrees per hour heading stability.
IonQ Real-Time Quantum Error Correction Single CPU
IonQ has demonstrated a complete real-time quantum error correction decoder running on one off-the-shelf CPU, addressing a major classical computing bottleneck in fault-tolerant quantum systems. Decoding normally falls behind the quantum hardware, forcing processors to pause. IonQ tested its dual-decoder design on simulated circuits with more than 31.5 million quantum operations, spanning up to 408 logical qubits across 88 memory blocks and magic factories.
Under standard noise conditions, the pipeline added just 0.02 percent stretch latency and created no measurable backlog. The result supports a core piece of IonQ’s Walking Cat architecture by showing that classical overhead does not grow exponentially with qubit count or circuit depth, and it lays groundwork for scaling beyond the current 256-physical-qubit Superion platform toward systems with thousands of qubits.
Cadence Adds RTL Generation to Its ChipStack AI Super Agent
Cadence Design Systems has added an RTL Generation Agent to its ChipStack AI Super Agent suite. It automates front-end chip design, turning natural-language specifications into RTL code and optimizing for power, performance, and area. It builds on the verification framework Cadence launched earlier this year and pairs generative models with Cadence’s design automation and signoff tools. In early benchmarks it delivered an average 24 percent area reduction and 18 percent power reduction over raw foundation-model output, with functional accuracy intact.
The agent also includes an automated revision flow for updating legacy RTL to meet new architectural constraints, functional changes, and PPA budgets. Honda R&D is evaluating it at its SDV R&D Center to speed front-end development for next-generation automotive chips, where safety-critical integrity, tight thermal margins, and short lead times are constant pressures.
Kigen GSMA Certification for SGP.32 v1.3 Automotive eSIM
Kigen has received GSMA eUICC Security Assurance certification for its automotive-grade eSIM, the first under the SGP.32 v1.3 IoT specification. Running on Infineon’s TEGRION SLI22 security controllers, it provides a common trust anchor for telematics units, infotainment systems, and headless control modules. The certification fits Infineon’s wider SLx22 family, letting automakers standardize software, management tools, and provisioning across cars, commercial vehicles, and two-wheelers.
The design supports the v1.3 additions, including direct and indirect profile downloads, digital activation codes, and emergency profile routing. For long-lifecycle security rules such as the EU Cyber Resilience Act, it offers secure eSIM OS updates and post-quantum cryptography through a hybrid approach that pairs standard and quantum-resistant algorithms. Suppliers can test it now with Kigen’s C-SDK and reference silicon.
Remote management runs through Kigen’s hosted eSIM IoT Manager and GSMA-accredited facilities, with digital activation across more than 20 carriers and 60 validated modules, including China Mobile International. Sampling in standard surface-mount packages begins in October 2026, alongside GSMA multi-vendor interoperability trials.