Connected Car News Tips: Tesla, TomTom, BMW, SOS Labs, Renesas, Kyocera, Vayyar, ANSYS, AEye & Zecotek

In connected car news this week were Tesla, TomTom, BMW, SOS Labs, Renesas, Kyocera, Vayyar, ANSYS, AEye and Zecotek.

Tesla Dashcam Feature

Tesla’s new software update 9 includes a dashcam feature to record the last hour of the front facing camera on o a USB drive. To record accidents and problems “External cameras will auto-activate in future if car is damaged while parked, ” Elon Musk Tweeted.

TomTom Lives Traffic for BMW

TomTom announced that it has been chosen by the BMW Group to provide drivers with Live TomTom Traffic information, Online Routing and Electric Vehicle (EV) Services for BMW, MINI and Rolls-Royce vehicles.

The deal is being announced after an extensive testing programm that began in April 2018.

TomTom Traffic provides drivers with live updates on upcoming traffic and delays, keeping the driver informed and reducing their total travel time. TomTom’s Online Routing technology uses cloud-based processing power to quickly send alternative routes to the navigation system embedded in the vehicle.

Leoni & Dieh Partnership

Leoni and Diehl have agreed a strategic partnership covering battery systems for electric and hybrid vehicles. Leoni is a global provider of energy and data management solutions in the automotive sector and other industries. Diehl is a significant partner to the automotive industry with its innovative solutions for hybrid and electric vehicles. The two companies will in future be working together on energy and data transmission as well as heat management across the entire value creation process. The partnership’s aim is to build on the skills of the two companies and to offer customers system solutions for electromobility from a single source

The investment of billions of US-Dollars in the U.S. car production of Mercedes-Benz is paying off: The first all new Mercedes-Benz GLE, which is based on a completely new SUV platform, left the production lines today bringing a new driver experience to our customers worldwide. At the same time, the electric initiative of Mercedes-Benz Cars in the U.S. is well on track. A groundbreaking ceremony on Friday, marked the start of the construction of a new battery factory. The factory will be built near the vehicle production site in Tuscaloosa providing batteries for future electric SUV under the product and technology brand EQ.

SOS Lab Funded

SOS LAB, a LiDAR development company focusing on innovative scanning solutions for autonomous vehicles, recently announced the completion of their Series A funding, securing over $6M from several major investment firms in South Korea. SOS LAB’s Series A strategic investor is Mando, a top-tier automotive supplier with a well-established global network in the field of mass-producing automotive parts. Other investors in this round include KDB Capital, Mirae Asset, Hancom Investment, Hyundai Investment Partners, SL Investment, WM Investment, BA Partners, RyukyungPSG Asset Management and Future Play.

Renesas New Controllers

Renesas Electronics  announced an innovative new family of bidirectional four-switch synchronous buck-boost controllers. The ISL81601 and ISL81401 are the industry’s only true bidirectional controllers that sense peak current at both ends and provide cycle-by-cycle current limit in both directions while in buck or boost mode. The controllers generate point-of-load (POL) and voltage rail conversions with peak efficiency up to 99 percent. The ISL81601 has a wide input range of 4.5V to 60V and produces a 0.8V to 60V output to support most industrial batteries: 12V, 24V, 36V and 48V. Also available is the ISL81401, a 4.5V to 40V input and 0.8V to 40V output version, and its unidirectional counterpart, the ISL81401A. The new controllers are well suited for DC power backup and battery-powered medical, industrial and telecommunication systems.
The ISL81601 and ISL81401’s bidirectional peak current sensing capability eliminates complex external circuitry required for charging and discharging a battery to supply power to the loads. Their proprietary algorithm provides smooth mode transitions between buck, boost and buck-boost, while reducing low frequency ripple at Vout, ensuring minimal disturbances during line or load transients. The algorithm also ensures predictable ripple voltage under all conditions. The addition of multilayer overcurrent protection and a precision control algorithm delivers constant current down to 0.1V at Vout for reliable operation. Designers can easily expand system power by paralleling an unlimited number of controllers. The ISL81601 and ISL81401 operate two switches at a time to minimize power loss and achieve higher efficiency.

New Kyocera Connector

Kyocera Corporation introduced a new clamshell-style branch connector for automotive electronics that features a unique locking structure for waterproof connections, ensuring reliability in harsh conditions. Samples are now available upon request.

Product Name Sheltap 9715 Series Waterproof Electronic Branch Connector
Application Branching Electronic Wiring for Automotive Equipment
Sample Shipment Date October 3, 2018
Key Benefits

• Waterproof, able to withstand high-pressure washing

• Operates in -40 to +85℃ (185ºF)

A branch connector is used to install electronic equipment, such as a navigation system or dashboard camera, by branching power from the vehicle’s main wiring harness. Since Kyocera introduced its original 9215 series branch connectors in 1992, the products have been lauded for providing reliable connections while streamlining assembly and installation workflow through their unique clamshell structure. In 2014, Kyocera became an early developer of connectors for aluminum wiring to support weight-saving initiatives among automakers. Rapid adoption of advanced driver assistance systems (ADAS) and other automotive electronics has created new demand for connectors that can withstand harsh environments, including the vehicle exterior and direct exposure to the elements in all weather conditions.

Vayyar New SoC EVK

Vayyar Imaging, the global leader in 3D radar imaging technology announced the launch of its new Automotive Evaluation Kit (EVK), representing a significant leap forward in the application of radar technology. The company’s new sensor kit delivers the world’s most advanced System on a Chip (SOC) for mmWave 3D imaging to the automotive industry. With this new sensor kit, Vayyar brings point cloud technology to radar, increasing radar’s resolution and capabilities, while reducing costs and minimizing the need for other sensors within the vehicle.

Vayyar’s highly-sophisticated radar sensors enable Valeo to monitor infants’ breathing and trigger an alert in the case of emergency, including if an infant has been left inside a vehicle alone. Through this partnership, the companies will work together toward mass production readiness to radically change the standard of safety in the automotive industry.

Vayyar’s new automotive sensor kit includes Vayyar’s 77-81Ghz ASIC, including 48 transceivers on a chip with internal DSP. It includes a sophisticated array of antennas and a USB interface. The company’s powerful sensors reduce the overall cost and number of sensors needed for the vehicle, resulting in a better driving experience and increasing the possibilities for in-car sensor capabilities for tier 1 customers and original equipment manufacturers (OEMs).

Vayyar’s Automotive Evaluation Kit enables:

  • Breathing monitoring
  • Location monitoring and activity level indication
  • Emergency life detection in the case of an accident (including number of people and their status)
  • Passenger counting
  • Assisted parking and driving
  • Point cloud representation
  • Lane switch and blind spot detection

ON Buys 220% Fujistu

ON Semiconductor Corporation and Fujitsu Semiconductor Limited today announced that ON Semiconductor will complete the incremental 20 percent share purchase of Aizu Fujitsu Semiconductor Manufacturing Limited, Fujitsu’s 8-inch wafer fab in Aizu-Wakamatsu, on Oct. 1, 2018. ON Semiconductor will hold a 60 percent majority ownership in the joint venture, and a brand transition will occur following the Oct. 1 close. Consequently, the company name of Aizu Fujitsu Semiconductor Manufacturing Limited will transition to ON Semiconductor Aizu Co., Ltd on Oct. 1, 2018.

Veolodyne Partners with MADD

What if the designated driver of the future was a self-driving car? How would such technology solve the drunk driving epidemic? Velodyne LiDAR is proud to partner with Mothers Against Drunk Driving (MADD) to create an online educational destination with information on how autonomous vehicles can help prevent roadway collisions. The site explains the basics of autonomous driving in easy-to-understand language for all audiences.


ANSYS SMC certified ANSYS solutions for the 7 nanometer FinFET Plus (N7+) process node with extreme ultraviolet lithography (EUV) technology and validated the reference flow for the latest Integrated Fan-Out with Memory on Substrate (InFO_MS) advanced packaging technology. The certifications and validations are vital for fabless semiconductor companies that require their simulation tools to pass rigorous testing and validation for new process nodes and packaging technologies.

ANSYS® RedHawk™ and ANSYS® Totem™ are certified for TSMC N7+ process technology that provides EUV-enabled features. Certification for N7+ includes extraction, power integrity and reliability, signal electromigration (EM) and thermal reliability analysis.

Industry-leading TSMC InFO advanced packaging technology is extended to integrate memory subsystem with logic die. TSMC and ANSYS enhanced the existing InFO design flow to support the new InFO_MS packaging technology, and validated the reference flow using ANSYS SIwave-CPA, ANSYS® RedHawk-CPA™, ANSYS® RedHawk-CTA™, ANSYS® CMA™ and ANSYS® CSM™ with the corresponding chip models. The InFO_MS reference flow includes die and package co-simulation and co-analysis for extraction, power and signal integrity analysis, power and signal electromigration analysis and thermal analysis.

Customers of TSMC and ANSYS (NASDAQ: ANSS) can accelerate the production of automotive design features through the Automotive Reliability Solution Guide 2.0, an outline of proven workflows to support customers’ intellectual property (IP), chip and package development for TSMC 7nm FinFET(N7) process technology. Based on TSMC and ANSYS collaboration on reliability solutions in ANSYS® RedHawk™, ANSYS® RedHawk-CTA™, ANSYS® Totem™ and ANSYS® Pathfinder-Static™, the expanded guide empowers customers to develop more efficient and robust chips for the next generation of smart automobiles.

AEye Speeds 10x More

AEye,announced that it has established a new speed benchmark for 300m+ class solid-state LiDAR sensors achieving scan rates of 100Hz or greater – a 10x improvement over currently deployed competitive systems which typically scan at 10Hz. AEye’s artificial perception platform, iDAR, is designed to mimic the performance of the human visual cortex. This biomimicry enables software-definable search patterns that can be optimized for specific driving situations that deliver much more precise and actionable information at speeds never seen in commercially available LiDAR sensors.

iDAR’s biomimicry enables autonomous perception engineers to create these situationally-specific scan patterns that are capable of searching a scene 4X-5X faster than the human eye. This scanning speed is matched by superior spatial coverage that breaks down a scene into Dynamic Vixels, a data type unique to iDAR which combines X,Y,Z and R,G,B data.

Improved Zecotek

Zecotek Photonics Inc.  a developer of leading-edge photonics technologies for healthcare, industrial and scientific markets announced that it has initiated the manufacturing of its new generation series of solid-state micro-pixel avalanche photo diodes and transistors (MAPD/T) at the Malaysian Institute of Microelectronics Systems.

Zecotek’s patented series of solid-state MAPD/T have been modified to improve performance parameters and reduce the cost of manufacture, and now offer significant performance-cost advantages over competing photomultiplier tubes (PMT) and other solid-state, silicon-based photo detectors known as SiPM. Recent changes have reduced the manufacturing cost and improved timing resolution and photon detection efficiency – key characteristics for the new configurations of high resolution PET medical scanners. The solid-state MAPD/T also offer superior recovery time, unique radiation hardness and display of the highest possible linearity, making them prime components for the improved detector designs required in high energy experiments at the Chinese Institute of High Energy Physics (IHEP) and CERN.


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Headquartered in Silicon Valley, Excelfore is driving smart mobility with innovative middleware for in-vehicle and vehicle-to-cloud networks, which is embedded into leading products such as the Molex automotive network platform. Excelfore’s software enables automotive OEMs and manufacturers to build the next generation of connected cars.