Connected Car News: Inova, Ansys, Intel, Uber Freight, FIC, SaverOne, Keysight, ACECC, AOS & Toshiba

In connected car news are Inova, Ansys, Intel, Uber Freight, FIC, SaverOne, Keysight, ACECC,
AOS and Toshiba.

New Inova Semis

Inova Semiconductors announces the release of their INAP567TAQ and INAP597TAQ transmitter ICs; two new members of the APIX3 SerDes product family. APIX (Automotive Pixel Link) is a multi-channel SerDes (Serialiser/Deserialiser) technology developed by Inova for automotive high-resolution video applications. The ICs are primarily used in vehicle cockpits and infotainment systems. The latest APIX3 generation can establish multiple display connections even with daisy-chained displays with a bandwidth of up to 12 Gbit/s and supports HD and Ultra HD displays.

The new INAP567TAQ and INAP597TAQ transmitters offer a DisplayPort 1.4a video interface with support of Single-stream (SST) or Multi-stream Transport (MST) for up to 4 Videos, each with up to 360 MHz pixel clock. Up to four DP lanes with a maximum of 5.4 Gbit/s each (HBR2), as well as an AUX data channel with 1 Mbit/s are available.

The INAP597TAQ device additionally supports the encryption of audiovisual content according to the HDCP 2.3 standard as an HDCP repeater between the DisplayPort and the APIX3 link. The encrypted video from the SOC is transmitted to a corresponding APIX3 receiver component. All necessary HDCP keys are stored individually in each component.

The new devices of the APIX3 family are designed for popular automotive displays (e.g., 2880 x 1080 x 24 bit, 60 Hz). Nonetheless, video resolutions with up to 8190 active pixels per line and colour depths up to 30 bits are also possible via tunneling and transmission of VESA DSC-compressed video data. Optional video CRC and 4 error protected AShell data transmission channels support the implementation of safety critical links to multiple receivers.

SPI interfaces are available for convenient local or remote component configuration and bidirectional data transfer of up to 30 Mbit/s. Four GPIOs allow user signals to be transmitted directly to or from the receiver via the APIX3 link. Simultaneously, the devices enable the transmission of 100 Mbit Ethernet according to the IEEE standard via its media-independent interface (MII, RMII, RGMII) as well as up to eight audio channels via I²S.

The transmitters can establish one APIX2 link or two APIX3 links with all compatible receivers via a QTP or STP cable. The components support various EMC-friendly operating modes with fixed bandwidths of 1.5, 3 or 6 Gbps in single-lane mode or 3, 6 or 12 Gbps in dual-lane mode with a fixed back channel of 187.5 Mbps.

In APIX3 mode the automatic link training adopts the APIX3 link to the cable medium and ensures very robust, stable and optimized transmission. With its many diagnostic features, APIX3 supports safety-related applications. The products meet the requirements of the automotive industry for electromagnetic immunity and resistance.

Typical applications for the new APIX3 chips are infotainment systems, instrument clusters and head-up displays in vehicles with multiple displays being connected in a daisy-chain to a single transmitter device, saving components and space on the head unit. The APIX3 devices are backward compatible with the APIX2 product family.

Ansys & Intel Foundry with EMIB for RedHawk

Ansys (NASDAQ: ANSS) and Intel Foundry collaborated to provide multiphysics signoff solutions for Intel’s innovative 2.5D chip assembly technology, which uses EMIB technology to connect the die flexibly and without the need for through-silicon vias (TSVs). Ansys’ accurate simulation engines deliver higher speeds, lower power consumption, and greater reliability in advanced silicon systems for artificial intelligence (AI), high-performance computing, autonomous driving, and graphic processing.

Ansys RedHawk-SC Electrothermal™ is an electronic design automation (EDA) platform that enables multiphysics analysis of 2.5D and 3D-ICs with multiple dies. It can perform thermal analysis with anisotropic thermal conduction, which is essential for Intel’s new backside power distribution technology. Thermal gradients also lead to mechanical stresses and warpage that can impact product reliability over time. Power integrity verification is done through chip/package co-simulation, which gives the 3D system-level context needed for maximum accuracy.

“Intel’s enablement of Intel 18A and EMIB technology is a differentiated approach to multi-die assembly that has a number of significant advantages over traditional stacking techniques,” said Rahul Goyal, vice president & general manager, product and design ecosystem enablement at Intel. “We will collaborate closely with Ansys to make the full benefit of this innovation easily accessible to our joint customers so they can create more competitive products.”

“Ansys has collaborated with Intel Foundry at the leading edge of 3D manufacturing technology to solve complex multiphysics challenges and meet stringent thermal, mechanical, performance, and reliability requirements,” said John Lee, vice president and general manager of the electronics, semiconductor, and optics business unit at Ansys. “Ansys’ multiphysics signoff platform gives our mutual customers the flexibility to adopt EMIB technology for their system architecture and assemble the best-of-breed solutions for higher performance products and a smooth user experience.”

Uber Freight Pilots News Scheduling API

Uber Freight, the leading end-to-end enterprise suite powering intelligent logistics,  announced a piloted rollout of a new scheduling application programming interface (API), making it the first activation of the Scheduling Standards Consortium’s (SSC) Technical Standard for the industry. The new API, designed for Uber Freight’s transportation management systems (TMS), offers enhanced scheduling capabilities and fosters seamless communication across its network of shippers and carriers. The active pilot is set to be fully released for general availability in the second half of 2024.

Across the industry, scheduling inefficiency not only contributes to a significant cost in servicing the load, but also causes delays in getting appointments set and increases the lead time required to get the load serviced. To address this challenge, Uber Freight began testing its new scheduling API within the company’s brokerage business. The team saw early success in getting loads made available within the digital marketplace with zero human intervention, and loads are ready for coverage as much as 75% faster compared to manual scheduling. With today’s announcement, Uber Freight will enable automated scheduling within the Uber Freight TMS, which facilitated 6 million appointments across more than 1,500 facilities in 2023.

Driving Efficiencies Across the Marketplace 
Uber Freight’s scheduling API empowers seamless integration between logistics technology platforms and carrier scheduling systems, eliminating manual processes and enhancing visibility across supply chains. The new feature delivers substantial benefits for both shippers and carriers, including:

For Shippers:

  • Faster appointment scheduling: Reduce lead times and expedite shipment preparation by streamlining the appointment booking process.
  • Increased visibility and control: Gain real-time insights into dock activity and manage appointments with ease, minimizing disruptions and rescheduling.
  • Enhanced carrier relationships: Foster stronger partnerships with carriers by providing a standardized, efficient and self-service scheduling experience.

For Carriers:

  • Simplified integrations: Eliminate the need for multiple logins and manual data entry through standardized API connections.
  • Improved appointment accuracy: Reduce errors and miscommunication with a single source of truth and centralizing scheduling data.
  • Increased operational efficiency: Helps optimize driver schedules and mitigate facility congestion by leveraging real-time facility data.


Driven by advances in technology, the automotive industry is witnessing a revolutionary innovation: Augmented Reality Head-Up Display (AR HUD). This technology has been transforming the driving experience, providing unprecedented convenience and safety for drivers.

For safety reason and to avoid watching the Cluster or the IVI info by lower your head down, FIC AR HUD is designed to let the drivers keep their heads up and pay more attention on the road, giving them more convenient ways to experience better driving behavior.

FIC AR HUD is uniquely designed based on the LBS technology, which brings up high contrast, high brightness, and low power consumption. The AR images projected through the device give great clarity under multiple driving situations, such as direct sunlight, night, cloudy, heavy fog, and even on a rainy day.

Providing the high-resolution AR image under FOV angle from 6~42 degrees and the VID of 3~50 meters are the leading spotting lights of FIC AR HUD. Seven algorithms are designed to integrate with the road and traffic environment, combining the virtual and the reality together to make driving safe and convenient.

In addition to navigation, vehicle speed, vehicle information, and ADAS information, FIC AR HUD includes driver monitoring systems and driver behavior systems, to enhance the safety of the driving experience. FIC Laser AR HUD is on the road to advanced AR HUD and plans ahead to become the portal of the In-Vehicle Metaverse.

SaverOne Launches Pilot

SaverOne 2014 Ltd. (Nasdaq: SVRE) (TASE: SVRE), a technology company engaged in transportation safety solutions, tannounced that it has launched a new pilot project in the United States with Motor Supply, Inc.

Motor Supply is a trucking company based in Columbia, South Carolina that is focusing on leveraging the latest technology to efficiently transport goods across the United States. SaverOne’s System was installed on a portion of Motor Supply’s fleet of sixteen trucks. The pilot is expected to run over a period of 12 months and, if successful, potentially expand to the rest of the fleet and any future trucks that Motor Supply may operate.

Keysight Tech Autotalks SoC for V2X

Keysight Technologies, Inc. (NYSE: KEYS) has enabled Autotalks to verify the TEKTON3 vehicle-to-everything (V2X) system-on-a-chip (SoC) that meets the physical layer specifications of the 3GPP 5G New Radio (NR) Release 16 (Rel-16) Sidelink standards using PathWave V2X solutions.

Sidelink is a feature of 3GPP Rel-16 that supports direct communication between two devices and is a key enabler of next-generation 5G NR V2X Day 2 use cases that improve road safety. An example of a Day 2 use case is cooperative perception, where two vehicles with 5G NR V2X technology can communicate with each other and share information detected by the vehicles’ sensors. Sidelink features are enabled through the physical layer communication, which defines the signals and channels needed for robust, stable, and feature-rich communication. To ensure reliable and interference-free communication among vehicles, rigorous physical layer testing is needed during the design and verification stage of SoC development.

Autotalks used the PathWave X-Series measurement application for 5G NR V2X operating on the Keysight MXA signal analyzer and the PathWave Signal Generation for 5G NR V2X running on the Keysight EXG signal generator to test the TEKTON3 5G V2X transceiver. The PathWave X-Series measurement application provides one-button testing for 5G NR V2X spectrum and power measurements such as channel power, spectral emission mask, adjacent channel power ratio, occupied bandwidth, and complementary cumulative distribution function defined in the TS38.521-1 transmitter conformance test specification.

Amos Freund, Vice President of Research and Development, Autotalks, said: “To ensure the development of this state-of-the-art technology, we strongly believe it must go through an advanced validation process. Working collaboratively with Keysight, we were able to validate our third generation V2X chipset baseband and radio characteristics, paving the way for the most advanced safety use cases in the automotive industry.”

Thomas Goetzl, Vice President and General Manager of Keysight’s Automotive and Energy Solutions, said: “Sidelink is an essential enabling technology for 5G V2X Day 2 use cases that promise improved safety and a better overall driving experience. With our easy-to-use PathWave NR V2X signal analysis and generation software suite, Autotalks gained valuable access to 3GPP standard-compliant measurements and signals that saved R&D resources and time, as well as accelerated the verification of its TEKTON3 SoC.”


The CAMARA Project, an open source community addressing telco industry API interoperability under the auspices of the Linux Foundation, and the Automotive Edge Computing Consortium (AECC), a non-profit consortium of cross-industry players working to drive best practices for the vehicle and computing convergence,  announced the signing of a Memorandum of Understanding (MoU) for formal collaboration.

Through this collaboration, AECC and CAMARA will work together to ensure interoperability and compatibility across diverse connected vehicle platforms. By establishing common standards and frameworks, the collaboration aims to unlock the full potential of connected vehicle services and accelerate the adoption of next-generation automotive technologies.

“Aligning Project CAMARA with AECC is the next step in enabling the next generation of connected vehicle services,” said Arpit Joshipura, general manager, Networking, Edge and IoT, the Linux Foundation. “Integrating CAMARA API architecture and use cases into AECC member company workflows provides a vendor-neutral approach to solving the expanding data management needs of connected vehicle services and enables needed infrastructure to scale globally.”

By collaborating with CAMARA, AECC will contribute to a universal network of APIs, designed to offer developers and enterprises universal access to operator networks, driving innovation and enabling seamless connectivity for connected vehicle services. The Telco API offers various advantages tailored to meet diverse user requirements. For instance, by leveraging operator networks, connected vehicle services such as HD mapping can assist users in locating available parking spaces, while intelligent driving can enhance safety and efficiency. User-centric services built upon universal standards are gaining prominence within the telecommunications sector. Moreover, API unification is indispensable for global service providers.

“We are pleased to join forces with CAMARA to address challenges related to API interoperability in the connected vehicle industry,” said AECC President and Chair Dr. Ryokichi Onishi, a Principal Engineer and General Manager at Toyota Motor Corporation. “By collaborating with CAMARA through the GSMA Open Gateway, AECC will enable faster time to market for a new era of connected vehicle services.”

CAMARA and AECC will support collaboration across their respective communities, with AECC member companies contributing to Project CAMARA. In addition, the two organizations will work together to mutually educate the market, and help build the connected vehicle services ecosystem for AECC. Sample joint programs and activities may include:

  • Boot Camps or workshops for target verticals
  • White papers
  • Case studies
  • Proof of Concepts
  • Research
  • Webinars
  • Hosted events, trade shows or joint speaking engagements

In addition, the AECC and CAMARA may together identify pertinent events held by each organization to invite the other party, and the AECC may prepare a 1-1 educational session for the CAMARA Project on AECC technology.

The agreement enables both organizations to formally support collaboration and work together on connected vehicle services. CAMARA and its sub-projects and initiatives will work closely with AECC workstreams to mutually develop the use cases and underlying technology of open edge APIs in the automotive sector.

AOS Shows Power Management at APEC

Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules will showcase its complete line of advanced power management solutions at the Applied Power Electronics Conference (APEC). The new products are designed to meet key power management challenges in several key application areas and markets AOS focuses on.

Booth highlights-

  • Computing and Data Center: AOS’ multiphase Vcore solutions are expanding to power Intel, AMD as well as NVIDIA CPU/GPUs and cover applications from personal computers to data centers with a product family that ranges from 4-phase single rail to multi-rail converters of up to 16 phases. When paired with AOS’ industry-leading power stages, AOS controllers offer a complete Vcore solution to power next-generation chipset-based SoCs. AOS has also expanded its EZBuck™ family to cover application-specific rails for Intel and AMD platforms. The newly released AOZ22559QI is for the Intel Meteor Lake platform powering the VNN_AON rail.In addition, AOS continues to expand its leading portfolio of products in DC/DC, Hot Swap, and Load Switches. AOS recently released the AONZ66412, a 40V XSPairFET™ optimized for 28V Type C EPR for buck-boost application
  • Power Supply and Renewable Energy: AOS will showcase its growing High Voltage Super Junction MOSFET portfolio. AOS helps designers achieve efficiency and density goals while satisfying budget goals with its industry-leading αMOS5™ 600V to 700V Super Junction MOSFETs. Featuring Fast Switching, Robust UIS/Body Diode, and ease-of-use, these state-of-the-art MOSFETs meet the latest Server, Telecom Rectifier, Solar Inverter, EV Charger, Gaming, PC, and Universal Charging/PD design requirements.In addition, AOS released the AONA66916, a 100V AlphaSGT™ MOSFET in a DFN 5×6 double sided cooling package. The new device offers industry-leading Rthjc-top and Rthjc-bottom thermal resistances, allowing for improved thermal designs in demanding telecom, solar, and DC-DC converter applications.
  • Automotive and E-mobility: AOS is expanding its portfolio of automotive MOSFETs with new released automotive grade 80V (AOTL66810Q) and 100V (AOTL66912Q) MOSFETs in the TOLL package. The AOS automotive TOLL package is designed to achieve the highest current capability by utilizing advanced clip technology to achieve a high in-rush current rating. In addition, AOS TOLL packaging with clip technology offers very low package resistance and inductance, enabling improved EMI performance compared to other TOLL packages utilizing standard wire-bonding technology packages. These new products help designers meet the ongoing trend to electrify vehicles and find use in battery management systems (BMS) and high-performance inverters (BLDC motors) for e-mobility.
  • Motor Drives: AOS introduces a new range of 60V and 100V drivers for power tools, outdoor garden equipment, and e-mobility applications. AOZ32101DV (100V half bridge), AOZ32103MQV (100V 3-phase), and AOZ32063MQV (60V 3-phase) all support 100% duty cycle operation required for demanding motor drive applications and provide a complete solution when paired with AOS MOSFETs. Visit our booth to see demo boards using AOS motor drivers and MOSFETs.
  • Silicon Carbide (SiC) MOSFETs: AOS has expanded its SiC MOSFET portfolio with 650V / 750V / 1200V SiC MOSFETs for industrial and automotive applications. These new 650V/750V MOSFETs are AEC-Q101 automotive qualified and deliver industry-leading RDS(ON) ranges from 15mohm to 500mohm.
  • Intelligent Power Modules, Mega IPM7: The world’s most compact package design integrates AOS’ latest RC IGBT and high-voltage gate driver delivering mega power of up to 100W in motor control applications. The portfolio covers 600V / (1A – 3A), in a variety of package options (Mega IPM-7D, IPM-7DT, IPM-7E, IPM-7ET) suited to different design requirements.

Where: APEC 2024, Long Beach, CA, at the Long Beach Convention Center
When: February 26 to 29, 2024
Location: Alpha and Omega Semiconductor, Booth #1345

Toshiba  DTMOSVI (HSD) Series

Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has added DTMOSVI(HSD), power MOSFETs with high-speed diodes suitable for switching power supplies, including data centers and photovoltaic power conditioners, to its latest-generation[1] DTMOSVI series with a super junction structure. Shipments of the first two products “TK042N65Z5” and “TK095N65Z5,” 650V N-channel power MOSFETs in TO-247 packages, start today.

The new products use high-speed diodes to improve the reverse recovery[2] characteristics important for bridge circuit and inverter circuit applications. Against the standard DTMOSVI, they achieve a 65% reduction in reverse recovery time (trr), and an 88% reduction in reverse recovery charge (Qrr) (measurement conditions: -dIDR/dt= 100A/μs).

The DTMOSVI(HSD) process used in the new products improves on the reverse recovery characteristics of Toshiba’s DTMOSIV series with high-speed diodes (DTMOSIV(HSD)), and has a lower drain cut-off current at high temperatures. The figure of merit “drain-source On-resistance × gate-drain charges” is also lower. The high temperature drain cut-off current of TK042N65Z5 is approximately 90%[3] lower, and the drain-source On-resistance × gate-drain charge 72% lower, than in Toshiba’s current TK62N60W5[4] [5]. This advance will cut equipment power loss and help to improve efficiency. The TK042N65Z5 shows a maximum improvement in power supply efficiency over the current TK62N60W5 of about 0.4%, as measured in a 1.5kW LLC circuit[6].

A reference design, “1.6kW Server Power Supply (Upgraded)”, that uses TK095N65Z5 is available on Toshiba’s website today. The company also offers tools that support circuit design for switching power supplies. Alongside the G0 SPICE model, which verifies circuit function in a short time, highly accurate G2 SPICE models that accurately reproduce transient characteristics are now available.

Toshiba plans to expand the DTMOSVI(HSD) line-up with the release of devices in TO-220 and TO-220SIS through-hole packages, and TOLL and DFN 8×8 surface-mount packages.

The company also will continue to expand its line-up of the DTMOSVI series beyond the already released 650V and 600V products and the new products with high-speed diodes. This will enhance switching power supply efficiency, contributing to energy-saving equipment.

[1] As of February 22, 2024, Toshiba survey.
[2] A switching action in which the MOSFET body diode switches from forward to reverse biased.
[3] Values measured by Toshiba. The new products TK042N65Z5 is 0.2mA (test condition: VDS=650V, VGS=0V, Ta=150°C.)
The existing products TK62N60W5 is 1.9mA (test condition: VDS=600V, VGS=0V, Ta=150°C).
[4] 600V DTMOSIV(HSD) series
[5] Values measured by Toshiba.
Test condition:
• RDS(ON): ID=30.9A, VGS=10V, Ta=25°C
• Qgd: VDD=400V, VGS=10V, ID=61.8A, Ta=25°C
• RDS(ON): ID=27.5A, VGS=10V, Ta=25°C
• Qgd: VDD=400V, VGS=10V, ID=55A, Ta=25°C
[6] Values measured by Toshiba.
Test condition: Vin=380V, Vout=54V, Ta=25°C


Industrial equipment

  • Switching power supplies (data center servers, communications equipment, etc.)
  • EV charging stations
  • Power conditioners for photovoltaic generators
  • Uninterruptible power systems


  • MOSFETs with high-speed diodes in the latest-generation DTMOSVI series
  • Reverse recovery time due to high-speed diodes:
    TK042N65Z5 trr=160ns (typ.)
    TK095N65Z5 trr=115ns (typ.)
  • High-speed switching time due to low gate-drain charge:
    TK042N65Z5 Qgd=35nC (typ.)
    TK095N65Z5 Qgd=17nC (typ.)

Main Specifications

(Ta=25°C unless otherwise specified)

Part number






Size (mm)


15.94×20.95, t=5.02




Drain-source voltage VDSS (V)


Drain current (DC) ID (A)



Drain-source On-resistance RDS(ON) (Ω)

VGS=10 V




Total gate charge Qg (nC)




Gate-drain charge Qgd (nC)




Input capacitance Ciss (pF)




Channel-to-case thermal resistance Rth(ch-c) (°C/W)




Reverse recovery time  trr (ns)




Toshiba’s current series (DTMOSIV) part number




[7] VDSS=600V

Follow the links below for more on the new products.

Follow the link below for more on Toshiba MOSFETs.

* Company names, product names, and service names may be trademarks of their respective companies.
* Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.

About Toshiba Electronic Devices & Storage Corporation