In connected car news are Hyundai Mobis, Mercedes-Benz, EverDriven, Isuzu, BASF, Sony, Quintauris and Everspin.
In this Article
Hyundai Mobis’ ‘Auto Semicon Korea’
Hyundai Mobis has initiated Korea’s first private-sector-led automotive semiconductor collaboration, uniting more than 20 companies and research institutions under the new forum “Auto Semicon Korea” (ASK). The inaugural event in Seoul brought together major players such as Samsung Electronics, LX Semicon, SK keyfoundry, DB HiTek, and GlobalFoundries to build a self-sustaining domestic semiconductor value chain. With Hyundai Mobis leveraging its dual role as a Tier 1 automotive supplier and fabless designer, the initiative aims to localize core components, accelerate R&D, and reduce reliance on foreign suppliers. The company plans to expand ASK into an annual forum, encouraging startups and consumer semiconductor firms to enter the mobility sector, while fostering faster development cycles and mass production of semiconductors critical to EVs, ADAS, and connectivity systems in a market projected to reach $135 billion by 2030.
Mercedes-Benz Spins Off Athos Silicon
Mercedes-Benz has announced a reference design collaboration with Athos Silicon, a semiconductor startup founded by former engineers at Mercedes-Benz Research & Development North America. Originating from research begun in 2020, the partnership aims to scale advanced chiplet architectures for next-generation autonomous driving platforms while expanding their use beyond automotive applications. Mercedes-Benz is contributing key intellectual property and ecosystem support as Athos Silicon develops its modular mSoC™ platform, designed for adaptable performance, faster development, and safety-by-design. Building on its leadership as the first automaker to join the UCIe Consortium in 2023, Mercedes-Benz is helping shape future chiplet standards, reinforcing its role at the forefront of high-performance autonomous computing innovation.
EverDriven & Google Maps Modernize Student Transport
EverDriven, a leader in alternative student transportation, has partnered with Google Maps Platform to integrate Google Navigation into the EverDriven Driver App. The move enhances safety, reliability, and transparency across school transportation. School districts gain improved oversight and more accurate ETAs, families receive greater confidence in pick-up and drop-off timing, and drivers benefit from dynamic re-routing, speed-limit alerts, and an integrated navigation experience. EverDriven says the collaboration with Google and Woolpert Digital Innovations marks a milestone in its technology vision and lays the groundwork for future innovations in student transportation.
Isuzu & Gray Break Ground on Plant in SC
Gray, a leading design-build firm, has broken ground on a new state-of-the-art motor vehicle production plant for Isuzu North America Corporation in Piedmont, South Carolina. The project involves the expansion and build-out of an existing 1,000,000-square-foot facility and will enable Isuzu to produce gas, diesel, and electric-powered vehicles. The new plant marks Isuzu’s first facility to feature a variable-model, variable-volume production system, eliminating traditional conveyors and pits in favor of a flexible, automated line. Ranked No. 3 Top Contractor for Auto Plants by Engineering News-Record, Gray brings decades of design-build expertise and experience with Japanese manufacturers to the project. This groundbreaking reflects Isuzu’s commitment to U.S. growth and its readiness for an increasingly electrified vehicle market.
BASF Recycles Automotive Plastics
At K 2025, BASF and partners ZF Group, Mercedes-Benz, and Pöppelmann showcased two pioneering recycling technologies designed to recover polyamides from end-of-life vehicles, helping close the loop on automotive plastics. Traditionally, about 200 kilograms of plastic per vehicle are incinerated, but BASF’s innovations aim to reclaim and reuse these materials in line with new End-of-Life Vehicle Regulation (ELVR) goals.
The first method, a chemical depolymerization process, breaks down used polyamide components—such as ZF oil pans—into their original monomers, which are purified and repolymerized into high-quality materials suitable for new car parts. The recycled polyamide was successfully used in a Mercedes-Benz chassis component, proving performance parity with virgin materials.
The second project focuses on solvent-based recycling of polyamides extracted from complex automotive shredder residue. By selectively dissolving and purifying polymers, BASF produced recycled PA6 compounds used in Mercedes-Benz chain guide rails, validating the technology for real-world production.
Life cycle analyses showed both processes significantly reduce CO₂ emissions compared to fossil-based and thermally recovered plastics. BASF emphasizes that combining mechanical, solvent-based, and chemical recycling methods is key to achieving true circularity. Mercedes-Benz supports the effort as part of its commitment to expanding the use of secondary raw materials in vehicles, while BASF continues advancing its #OurPlasticsJourney initiative to enable a sustainable plastics economy.
Sony IMX775 RGB-IR In-Cabin Monitoring
Sony Semiconductor Solutions Corporation announced the IMX775 CMOS RGB-IR image sensor, the industry’s smallest 2.1 µm pixel sensor, offering approximately 5 megapixels of resolution and the highest near-infrared sensitivity and RGB dynamic range for in-cabin automotive cameras. Designed to enhance driver and passenger monitoring, the sensor captures clear, wide-angle RGB and IR images simultaneously on a single chip, supporting accurate detection of gaze, posture, and seat belt use even in low light. Featuring Sony’s proprietary pixel structure, the IMX775 delivers 35% quantum efficiency at 940 nm and a record 110 dB RGB dynamic range through a hybrid rolling-global shutter system. An on-chip algorithm removes IR interference for precise color reproduction, while built-in image processing and cybersecurity features ensure compact, secure integration. Compliant with automotive standards ISO 26262 (ASIL-B) and AEC-Q100 Grade 2, the IMX775 will enter mass production following certification, setting a new benchmark for safety-focused in-cabin imaging.
Quintauris & Everspin MRAM Memory for RISC-V Automotive
Quintauris and Everspin Technologies announced a strategic collaboration to integrate Everspin’s MRAM and STT-MRAM technologies into the Quintauris RISC-V ecosystem, enhancing reliability, data integrity, and functional safety for automotive, industrial, and edge applications. The partnership combines Everspin’s proven non-volatile memory expertise with Quintauris’ real-time architectures to deliver high-performance, safety-certified memory subsystems capable of maintaining data under power loss, radiation, or extreme temperatures. Aligned with both companies’ focus on long-term supply and automotive readiness, the collaboration aims to accelerate adoption of RISC-V in next-generation safety-critical systems.