Mercedes Benz myQ Garage Via Dash
Chamberlain Group, a global leader in smart access solutions, has joined forces with Mercedes-Benz AG by adding myQ Connected Garage Control to the Mercedes-Benz MBUX Infotainment System. myQ, a dynamic technology platform developed by Chamberlain Group, enables cloud based smart access control solutions including the ability to control garage access from a vehicle’s in-dash display or through in-vehicle voice control.
Mercedes-Benz drivers with a myQ connected garage door opener are the first to have their own in-vehicle, voice-controlled personal assistant to open, close and check the status of their garage door from anywhere on the road. Garage control is a top feature MBUX users have been asking for and will soon be available in selected models of Mercedes-Benz vehicles that have the MBUX voice assistant enabled.
Country Fin. Partners with CMT
COUNTRY Financial® has announced a partnership with Cambridge Mobile Telematics (CMT), the global leader in smartphone telematics, to launch COUNTRY Financial DriverIQ, an innovative program that provides feedback on driving behavior and provide discounts to safer drivers.
COUNTRY Financial DriverIQ is powered by CMT’s DriveWell technology to accurately measure risky driving behavior. The app uses smartphone sensors, privately shared between client and COUNTRY Financial only, to measure speeding, harsh braking, sharp turns, acceleration, and phone distraction. After a trip is recorded, drivers receive instant feedback on how to improve their driving and earn rewards for good scores. CMT’s research shows that data has found that people who regularly engage with the app and record trips achieve long-term behavior change, and become better drivers, and significantly reduce their auto insurance costs.
OCTO Telematics Partners with Ford
OCTO Telematics announced a new agreement with Ford Motor Company. By leveraging Ford’s connected vehicle data, OCTO will extend its market-leading predictive insurance risk score, OCTO DriveAbility® Score. The integration provides a seamless experience for auto insurers and their policyholders with highly accurate pricing based upon driving data sourced directly from Ford vehicles fitted with embedded connectivity.
DriveAbility Score combines Ford connected vehicle data, available on the majority of MY2020 and newer Ford and Lincoln vehicles, in context of factors such as weather and road type, with policy and claim data across a large pool of insurers to provide a score that is not only highly predictive of loss costs but is accurate from the very first trip. DriveAbility has scored more than one million vehicles across five continents and is configurable to meet specific auto insurer requirements.
“We are pleased to join forces with Ford to leverage their connected vehicle technology to enhance insurance risk scoring for insurers and their customers,” said Nicola Veratelli, CEO, OCTO Telematics, “and we look forward to exploring opportunities for incremental mobility services that benefit OCTO clients and Ford vehicle owners alike.”
OCTO DriveAbility Score takes an owner-centric approach to connected services. Ford owners with compatible vehicles can opt-in through participating insurers to learn more about their driving behaviors and the opportunity to be rewarded for safe driving.
Agillence Optimizes Software for Toyota
Renesas New SoCs
–Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, added a new series to its popular R-Car system-on-chips (SoCs) with the R-Car Gen3e. Featuring six new members, the new R-Car Gen3e series of SoCs offers a scalable lineup for entry- to mid-range automotive applications that require high-quality graphics rendering, such as integrated cockpit domain controllers, in-vehicle infotainment (IVI), digital instrument cluster, driver monitoring systems, and LED matrix light.
The new devices extend the successful R-Car Gen3 SoC products with increased CPU performance up to 50k DMIPS and 2GHz speeds to help carmakers navigate demands for continuous user experience, security, and safety improvements.
Renesas provides Winning Combination solutions featuring the R-Car Gen3e devices to shorten development time and reduce bill of materials (BOM) costs. Customers can combine the R-Car Gen3e devices with Renesas’ high-accuracy timing ICs, power management products.
“With the growing popularity of applications such as augmented reality navigation and AI-based digital automotive assistants, OEMs and Tier 1s need to balance the skyrocketing demand for larger, higher resolution displays and high-performance chips with rising BOM costs and longer development times, ” said Naoki Yoshida, Vice President Automotive Digital Products Marketing at Renesas. “The new R-Car Gen3e devices and reference solutions offer a seamless and cost-effective migration path, providing full compatibility and easy integration with Renesas’ current R-Car Gen3 SoCs to make it quicker and easier for customers to bring their automotive-grade applications to market.”
Key Features of the R-Car Gen3e SoCs: R-Car D3e, R-Car E3e, R-Car M3Ne, R-Car M3e, R-Car H3Ne, and R-Car H3e
- Increased CPU performance – up to 2GHz for the R-Car M3Ne, R-Car M3e, and R-Car H3e devices
- On-chip real-time Arm® Cortex® R7 CPU to eliminate the need for an external vehicle controller combined with a Renesas PMIC, reducing overall BOM costs
- Reduced development times with reference solutions for fast boot, HMI, and functional safety
- Board support packages updated with the latest versions of the Linux and Android operating systems
R-Car Gen3e Reference Solutions
- Pre-integrated software enables higher application integration, for example for 2D/3D cluster HMI, welcome animation, rear-view camera, and surround view applications
- VirtIO technology allows developers to easily add the reference solutions to existing applications without changing the existing Linux or Android application
- Supports ASIL-B system safety requirements for applications such as telltale monitoring and camera freeze detection, as well as for true hardware separation in non-hypervisor cockpits
- The R-Car Consortium (RCC) partner ecosystem includes system integrators, middleware/application developers, and operating system and tools vendors, providing innovative solutions for the connected Car, ADAS, and gateway markets that enable customers to reduce development time and accelerate time to market for new products.
Synopsis & Samsung Foundry For VC FSM
Synopsys, Inc. (Nasdaq: SNPS) announced that Samsung Foundry collaborated with Synopsys on its VC Functional Safety Manager solution. VC Functional Safety Manager (VC FSM) provides the necessary automation for the functional safety Failure Mode Effects Analysis (FMEA) and Failure Modes Effects Diagnostic Analysis (FMEDA) for automotive SoCs.
Samsung collaborated with Synopsys to advance VC FSM as part of Synopsys unified functional safety solution because of its differentiated features covering safety analysis, verification and implementation, enabling designers to prove at the planning and implementation phases that their chip safety architecture can achieve the targeted Automotive Safety Integrity Levels (ASILs). Using VC FSM, customers can perform early analysis of the immediate effect of design changes on the ISO 26262 metrics, automate fault injection campaign for functional safety verification and synchronize the tracking and documentation of functional safety analysis with its requirement management, resulting in faster time to ISO 26262 compliance.
“To perform the detailed FMEA/FMEDA needed for ISO 26262 certification of automotive SoCs, our reference flow needs to integrate technology that enables early analysis, optimize flow automation and integrate with our requirement management tool,” said Sangyun Kim, vice president of Foundry Design Technology Team at Samsung Electronics. “Through our deep collaboration on functional safety with Synopsys, VC Functional Safety Manager provides the necessary innovation and automation to accelerate designers’ time to ISO 26262 compliance.”
New innovations developed in collaboration with Samsung Foundry for VC FSM include productivity-oriented features that result in faster time-to-market and improved system level cost for Samsung, such as:
- Support for top-down flow and what-if analysis enabling early safety architecture exploration
- Quick synthesis for RTL design data extraction, enabling failure rate estimates before a synthesized gate-level netlist is ready
- Support for application lifecycle management tools for easier integration in customer flows
- Handling failure modes and fault injection in analog parts of the SoC
“The increasing complexity of automotive SoCs for powertrain, autonomous driving and advanced driver assistance systems is creating more demand for integrated and highly productive solutions to efficiently perform functional safety analysis,” said Vikas Gautam, vice president of engineering in the Synopsys Verification Group. “Through our continuous innovation efforts and collaboration with Samsung, Synopsys is delivering the most advanced solution for automotive customers to accelerate its ISO 26262 functional safety deliverables.”
Ansys Improves 2021 R2 Products
Improvements in Ansys 2021 R2 products provide the power to explore early stage product design and complex system engineering from the nanometer scale of chip design to the mission level of aerospace and defense operating environments. Ansys’ (NASDAQ: ANSS) industry-leading simulation solutions provide an open approach that streamlines engineering via simplified workflows, integrated data management and easy access to high-performance computing (HPC) power via the cloud.
Engineering exploration via simulation is virtually risk free because engineers are no longer bound to an expensive and time-consuming prototype-test-redesign cycle. New design ideas can be virtually evaluated in hours, not weeks, freeing up time to optimize the best design candidates or develop moonshot ideas that redefine markets. With access to nearly limitless computing via Ansys Cloud, engineers who use Ansys 2021 R2 products have the speed and flexibility to ask the “what-if” questions that lead to innovations in autonomous vehicles, chip design, mission-critical connectivity solutions and more sustainable travel via lightweight materials and electrification.
Speed improvements are woven throughout the latest Ansys products.
- Productivity enhancements allow engineers to perform optical simulation meshing up to 20X faster and local meshing up to 100X faster.
- Ansys Mechanical 2021 R2 streamlines cyclic modal and structural analyses using a new multistage cyclic symmetry capability that can ultimately decrease run times by up to 50X when compared against a full 360 degree solve.
- In semiconductors, 2021 R2 provides 3nm-ready Advanced Power Analytics (APA) and improves voltage-drop fixing efficiency by 3X, using aggressor identification, what-if analysis and links to engineering change order (ECO) tools.
- Using the cloud for semiconductor simulation delivers at least 4X better cost and core-hour efficiency with Ansys 2021 R2.
- In fluids, Ansys 2021 R2 provides up to a 5X speed increase for high-speed flows to Mach 30 and above, with improved treatment of reaction sources in the density-based solver.
- Simplified, reduced-order workflows throughout Ansys 2021 R2 provide quick answers to product design and development problems, allowing engineers to concentrate computing power on the best design candidates.
- The new Phi Plus mesher meets 3D integrated circuit package challenges by accelerating initial meshing for bondwire package electromagnetics and signal integrity analysis by an average of 6-10x.