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Airbiquity Partners with BlackBerry
Airbiquity®, a global leader in connected vehicle services today announced it has joined forces with BlackBerry®, a trusted provider of secure connectivity solutions, to enable automakers to deliver over-the-air (OTA) updates to vehicles and meet the industry’s highest security standard. By integrating Airbiquity’s OTAmatic® Software Management Platform and the BlackBerry Certicom Code Signing Key Management Server, the two companies will empower OEMs to seamlessly adopt the Uptane Security Framework and address critical OTA security challenges including spoofing, unauthorized access, tampering, repudiation, man-in-the-middle, privilege escalation, and distributed denial of service (DDOS) attacks as vehicles grow increasingly software-defined.
Airbiquity’s OTAmatic Software Management Platform provides a comprehensive back-end management portal that allows automotive OEMs to efficiently execute multi-ECU software update campaigns at scale. The OTAmatic platform provides highly refined vehicle and device targeting, discrete policy and privacy controls, customizable consumer communications, solution deployment option flexibility, and enhanced multi-layer cybersecurity protection via integration of the compromise resilient Uptane Security Framework.
Ansys EM Modeling for Antennas
Ansys (NASDAQ: ANSS) expanded the upfront simulation capabilities in Ansys® Discovery™ to include high-frequency electromagnetics (EM) modeling for antennas. The launch empowers teams to virtually explore several design areas at once — minimizing the need for physical prototyping and testing, which helps accelerate development, reduce costs, and improve performance and efficiency.
The latest EM features add to Discovery’s existing capabilities and create a unique multiphysics simulation environment coupled with interactive geometric modeling along with seamless integration to the greater Ansys portfolio. The new offering enables companies to investigate new concepts early in the antenna design process leading to better performance for Internet of Things (IoT) applications as well as 5G technology and autonomous vehicles.
“Smart, highly miniaturized, implantable medical devices are enabling whole new therapeutic areas and improving patient care. A critical component of designing a smart implant is developing an efficient and robust wireless antenna,” said Dr. Arun Venkatasubramanian, senior vice president, Medical Technology Division at Cambridge Consultants, part of Capgemini Invent. “As a product development and technology consultancy that creates cutting-edge solutions, we are looking forward to using Ansys Discovery to augment our existing Ansys HFSS antenna design workflow. This will allow us to rapidly explore conceptual antenna designs and accelerate the delivery of innovative solutions to our clients.”
Discovery equips teams to quickly evaluate changes to element design and antenna placement without having to interpret or clarify complicated computer-aided design (CAD) geometry. Discovery automates the creation of EM regions based on desired frequency ranges and assigns conductive and dielectric material based on port definitions. This automation supports the rapid evaluation and integration of antenna concepts while eliminating manual geometry cleanup. Additionally, engineers and designers can seamlessly transfer the model and physics setup to Ansys® HFSS™ 3D high-frequency EM simulation software for final design validation.
“Adding EM capabilities in Ansys Discovery for antenna design not only shifts simulation left, but it democratizes simulation for all users from beginner to expert,” said Shane Emswiler, senior vice president of products at Ansys. “Discovery provides an easy-to-use interface with integrated modeling and access to other Ansys tools, which streamlines the antenna design process and results in optimized development, performance, and efficiency.”
To explore Discovery, register for a free trial today.
Samsung Foundry Cert for Ansys’ RedHawk
Ansys (NASDAQ: ANSS) announces that Samsung Foundry has certified Ansys’ RedHawk power integrity and thermal verification platform for Samsung’s family of heterogeneous multi-die packaging technologies. Samsung’s collaboration with Ansys recognizes the critical importance of power and thermal management on the reliability and performance of advanced side-by-side (2.5D) and 3D integrated circuit (3D-IC) systems.
Many leading semiconductor products for high-performance computing, smartphones, networking, artificial intelligence, and graphics processing are made possible by 3D-IC technologies, which can also help companies achieve competitive differentiation in their markets. Samsung offers a range of 2.5D packaging options (I-Cube and H-Cube) as well as 3D vertical stacking with X-Cube technology. The dense integration of multiple chips creates a major challenge in heat dissipation. A single die can draw well over 100W of power which must be routed through extremely fine microbump connections.
Samsung has collaborated with Ansys to certify RedHawk-SC Electrothermal for simulating temperature profiles with their packaging technology. Samsung also validated the predictive accuracy of RedHawk-SC Electrothermal with Ansys’ Icepak solution for thermal analysis of electronic assemblies—including forced-air cooling and heat sinks. RedHawk-SC verifies the electromigration (EM) reliability and voltage drop (IR drop) correctness of the entire power distribution network connecting the chiplets and interposer.
“Samsung Foundry sees heterogeneous integration as a critical technology for the future of the semiconductor industry,” said Sangyun Kim, vice president of Foundry Design Technology Team at Samsung Electronics. “But it also raises a number of new challenges and multiphysics concerns that need to be carefully analyzed for system success. Ansys is a valuable partner that offers us proven simulation technology that our customers can use for thermal management and power analysis for better performance and higher reliability.”
“Ansys’ deep expertise in the areas of power management and system analysis have allowed us to engage with our customers at the chip, package, and system level,” said John Lee, vice president and general manager of the electronics, semiconductor, and optics business unit at Ansys. “Our continuing partnership with Samsung keeps us at the forefront of silicon processing technology and helps our customers take full advantage of Samsung’s 3D-IC technology.”
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SaverOne Partners with IVECO
SaverOne 2014 Ltd. (NASDAQ: SVRE) (TASE: SVRE), a technology company engaged in transportation safety solutions, is pleased to announce that IVECO, the commercial vehicle brand of Iveco Group (MI: IVG), and SaverOne, have signed a side-letter related to the Memorandum of Understanding (MOU) of October 2022, to document the agreed upcoming plans. The letter also provides IVECO with an exclusivity period of up to six months during which SaverOne agreed not to sell, develop or manufacture its OEM solution for SaverOne’s innovative in-cabin Driver Distraction Prevention Solution (DDPS) with any other truck manufacturer.
The initial MOU with IVECO, marked the intention of IVECO to integrate SaverOne’s technology into their vehicles, aimed at enhancing road safety. The goal of the collaboration is to provide IVECO with a competitive edge by offering a safer driving experience to IVECO’s global customer base. It represents a key milestone in SaverOne’s international cooperation with a major OEM and in SaverOne’s growth trajectory.
The parties intend to start the development activities in the fourth quarter of 2023 following entry into an agreement, with the goal of elevating road safety standards in the trucking industry. Based on current estimates, roll out to customers is expected within the 2024 timeframe.