Connected Car News: Faurecia-Aptoide, Catappult,Toshibia, Stellantis, Wolfspeed, ZF & AUTOCRYPT

In connected car news are
Faurecia-Aptoide, Catappult,Toshibia, Stellantis, Wolfspeed, ZF & AUTOCRYPT.

Apps on Tap for Faurecia-Aptoide and Catappult

Faurecia-Aptoide and Catappult have announced they’re joining forces to launch an innovative app distribution service for cars.

Using Faurecia-Aptoide’s highly regarded app store technology, developers will now be able to distribute their games and apps in cars. Faurecia Aptoide already works with major automotive brands such as Volkswagen, BMW and Mercedes-Benz.

With the new service, available at Catappult, developers can now design and finetune their apps and games for cars, manufacturers will be able to customize their app stores, and users will get access to a wide range of apps and games tailored to their own interests and their car’s capabilities.

The new distribution hub is provided to mobile app developers through Catappult – the one stop shop for apps distribution across multiple channels. This means that developers not only can easily distribute apps in major global app stores, but also from now on in top car brands to enhance the consumer’s car digital experience.

Toshibia New MOSFETs

Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has launched automotive 40V N-channel power MOSFETs, “XPQR3004PB” and “XPQ1R004PB,” that use the new L-TOGL™ (Large Transistor Outline Gull-wing Leads) package and feature a high drain current rating with low On-resistance. Shipments start today.

In recent years, the transition to EVs has fueled demand for components adapted to the increased power consumption of automotive equipment. The new products use Toshiba’s new L-TOGL™ package, which supports large currents, low resistance, and high heat dissipation. The products do not have an internal post[1] structure, achieved by unifying the source connective part and outer leads with a copper clip. A multi-pin structure for the source leads decreases package resistance to about 30% that of the existing TO-220SM(W) package, pushing the drain current (DC) rating of XPQR3004PB to 400A—1.6 times higher than that of the current product[2]. Use of a thick copper frame has cut channel-to-case thermal impedance in XPQR3004PB to 50% that of the current product[2]. These features help larger current and lower the loss of automotive equipment.

With the new package technology, the new products will simplify heat dissipation design and lower the number of MOSFETs required in applications such as semiconductor relays and invertors for integrated starter generators that require large currents, and help to reduce equipment size. Assuming that multiple devices will be connected in parallel for applications requiring higher-current operation, Toshiba supports grouping shipment[3] for the new products, in which the gate threshold voltage is used for grouping. This allows designs using product groups with small characteristic variation.

Since automotive equipment is used in diverse temperature environments, the reliability of solder joints in surface mounting is a critical consideration. The new products use gull-wing leads that reduce mounting stress, improving the reliability of the solder joint.

[1] Solder connection
[2] Current product: “TKR74F04PB” with TO-220SM(W) package
[3] Toshiba can offer grouping shipment in which the gate threshold voltage range is 0.4V for each reel. However, specifying a specific group is not possible. Please contact Toshiba sales representatives for more details.


  • Automotive equipment: inverters, semiconductor relays, load switches, motor drives, etc.


  • New package L-TOGLTM
  • High drain current rating:
    XPQR3004PB : ID=400A
    XPQ1R004PB : ID=200A
  • AEC-Q101 qualified
  • Low On-resistance:
    XPQR3004PB : RDS(ON)=0.23mΩ (typ.) at VGS=10V
    XPQ1R004PB : RDS(ON)=0.8mΩ (typ.) at VGS=10V

Kyndril for Stellantis

Kyndryl (NYSE:KD), the world’s largest IT infrastructure services provider,  announced a new agreement with Stellantis to provide technology services and manage the company’s core IT infrastructure.

Under the agreement, Kyndryl will support Stellantis through the management of IT infrastructure services across its operations. Stellantis will use Kyndryl Bridge, an open integration platform that delivers solutions by leveraging Kyndryl’s core technology strengths, for real-time insights and unprecedented control over its IT environment.

“We are excited to support Stellantis’ transformation,” said Angelo Cirocco, Managing Partner, Kyndryl. “They are charting a course for operational excellence and using Kyndryl’s leading-edge technologies to support them as an industry leader in sustainable solutions.”

Kyndryl will infuse automation to drive efficiencies, provide global service capabilities to align with business priorities, and improve the quality of day-to-day IT performance to ensure smooth and efficient operations across Stellantis’ manufacturing facilities.

Kyndryl will leverage its talent base including at its India Customer Innovation Center for advanced delivery capabilities and customized solutions to support Stellantis’ needs.

Global in scale, the agreement spans operations in the U.S., Latin America, Italy, France, Poland and India.

Wolfspeed & ZF

Wolfspeed, Inc. (NYSE: WOLF), the global leader in Silicon Carbide technology and ZF, a global technology company enabling next generation mobility,  announced a strategic partnership that includes the creation of a joint innovation lab to drive advances in Silicon Carbide systems and devices for mobility, industrial and energy applications. The partnership also includes a significant investment by ZF to support the planned construction of the world’s most advanced and largest 200mm Silicon Carbide device fab in Ensdorf, Germany. Both the joint innovation lab and the Wolfspeed device fab are planned as part of the Important Project of Common European Interest (IPCEI) for Microelectronics and Communication Technologies framework, and are dependent upon state aid approval from the European Commission.

“These initiatives are a significant step towards a successful industrial transformation. They strengthen European supply resilience and, at the same time, support the European Green Deal and the strategic goals for Europe’s Digital Decade,” said Dr. Holger Klein, CEO of ZF.

Wolfspeed and ZF Partner on Silicon Carbide R&D Center

The strategic partnership includes a joint research facility in Germany that will focus on real world e-mobility and renewable energy system level challenges. The goal of the collaboration is to develop breakthrough innovations for Silicon Carbide systems, products, and applications, covering the full value chain from chip to complete systems. Additional collaboration partners will be invited to participate in the innovation process, establishing an end-to-end, European Silicon Carbide innovation network.

The R&D center will focus on innovation for Silicon Carbide systems and devices to meet specific requirements in all mobility segments including consumer, commercial, agricultural, and industrial vehicles as well as in the industrial and renewable energy markets. The collaboration will drive improvements such as higher efficiency, increased power density and higher performances for electrification solutions.

ZF to Invest in Wolfspeed for Next Generation 200mm Silicon Carbide Fab

As separately announced, Wolfspeed plans to construct a fully automated, highly advanced 200mm wafer fabrication facility in Saarland, Germany. ZF intends to support this new construction by making a sizable financial investment in the hundreds of millions of dollars in exchange for Wolfspeed common stock. As a part of this investment ZF will have a minority ownership position in the fab. Wolfspeed will maintain all operational and management control rights in the new fab. ZF and Wolfspeed previously announced a strategic partnership in 2019 to create industry-leading, highly efficient electric drivelines with a Silicon Carbide inverter, and these new initiatives represent the next generation of innovation for the partners.

“We have a strong partner by our side in ZF, which brings industry-leading experience in scaling components for electric mobility as well as the aptitude to accelerate innovation in Silicon Carbide systems and power devices. I am confident this partnership will lift Silicon Carbide semiconductor technology to a new level of global impact, supporting increased sustainability and efficiency efforts across a multitude of industries,” said Gregg Lowe, president and CEO of Wolfspeed.

“Together, Wolfspeed and ZF combine expertise in power electronics and systems with a know-how in applications that is unparalleled in the industry. Wolfspeed brings its more than 35 years in Silicon Carbide technology, and at ZF we have a unique understanding of the overall systems across all sectors – from passenger cars and commercial vehicles to construction machinery, wind power and industrial applications. The close cooperation between fab and R&D center will enable us to develop breakthrough innovations beyond state of the art for the benefit of our customers,” says Stephan von Schuckmann, Member of the ZF Board of Management.


A global leader in automotive cybersecurity and connected mobility technologies, AUTOCRYPT announced its certification for ASPICE Capability Level (CL) 2. One of the very first and few cybersecurity providers to achieve this certification, AUTOCRYPT was recognized for its well-established processes in securing in-vehicle systems and software.

ASPICE, or Automotive Software Process Improvement Capability Determination, is an assessment scale used to evaluate an automotive supplier’s software development and management procedures. It is a de facto standard for continuous improvements in the software supply chain, confirming all components are planned, performed, and managed systematically.

AUTOCRYPT obtained ASPICE CL2 certification for its AutoCrypt IVS-TEE software security platform, a trusted execution environment (TEE) built into application processors. Since the TEE is separated from regular operating systems, it allows applications to run in an isolated and secure environment. As one of the first to integrate TEE into the automotive ecosystem, AUTOCRYPT expects to further strengthen its international partnership network for in-vehicle software security.

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