Connected Car News: Renesas, Arasan, Telenav, Toshiba & Windbond

In connected car news are Renesas, Arasan, Telenav, Toshiba and Windbond.

Renesas & Steradian Semi Partner

Renesas Electronics Corporation (TSE:6723, “Renesas”), a premier supplier of advanced semiconductor solutions, today announced that it has entered into a definitive agreement to acquire Steradian Semiconductors Private Limited (“Steradian”), a fabless semiconductor company based in Bengaluru, India, that provides 4D imaging radar solutions, in an all-cash transaction. The acquisition is expected to close by the end of 2022, subject to customary closing conditions. The acquisition of Steradian’s radar technology will enable Renesas to extend its reach in the radar market and boost its automotive and industrial sensing solution offerings.

Arasan Certifications

Arasan Chip Systems, the leading provider of Total IP™ for automotive SoC’s announced that their eMMC Total IP which includes the eMMC Controller IP and the eMMC PHY IP have achieved the Automotive Safety Integrity Level B, the architectural metrics SPFM (Single Point Fault Metric) and LFM (Latent Fault Metric) certification, allowing customers to create ISO 26262-compliant SoCs for ADAS and autonomous driving applications.

Arasan’s eMMC controller is widely utilized in automotive, navigation, and car entertainment applications such as 3D maps, drive recorder, satellite radio, autonomous driving OS and Apps, telemetric and traffic monitoring. This eMMC IP performs admirably in severe conditions. It ensures that the application operates better as a result of improved technical support, prolonged life, and solid roadmaps.

Arasan eMMC™ 5.1 Total IP™ is designed in – house for functional safety, with cutting-edge safety features that greatly exceed current industry norms while keeping JEDEC compatibility. It features the HS400 high speed interface timing mode of up to 400 MB/s data rate, with “command queuing” – making the data transfers highly efficient by offloading the software overhead into the controller. eMMC™ 5.1 further improves the reliability of operation by utilizing an “enhanced strobe” at the PHY layer.

Arasan’s eMMC total IP solution comprehensive portfolio includes all the versions with silicon proven nodes down to 5nm.

Arasan also offers a complete suite of MIPI IP including the CSI IP for Camera, DSI IP for Display along with its seamless integrated C-PHY IP and D-PHY IP for automotive applications. Arasan’s Ethernet IP and CAN IP round out our comprehensive automotive IP Portfolio.

Bridgestone Corporation (Bridgestone)  announced that the company is using Amazon Web Services, Inc. (AWS) as its strategic cloud provider in support of the company’s sustainable mobility solutions. Using AWS Internet of Things (IoT), machine learning, and analytics / business intelligence services, Bridgestone will accelerate the creation of digital platforms to launch new solutions for its customers, improve data analysis and streamline IT operations. This relationship further marks an important milestone in the Bridgestone 3.0 journey toward enhanced corporate value that merges business strategies with sustainability initiatives.

As part of the relationship, Bridgestone will work with AWS’s ProServe and AWS Marketplace teams to enhance our existing fleet solutions and bring concepts like a Bridgestone marketplace to life. The Bridgestone fleet solutions and service-centric marketplace concept will provide a comprehensive selection of services and solutions to fleet managers to proactively assess fleet needs and reduce vehicle downtime. With these digitally enabled solutions, fleet managers will have greater insights into the health of their fleets, proactive maintenance needs, access to a broad network of service providers, and scheduling and digital payment options that ultimately unlock customer and social value.///

Telenav Shares Market Share Stats

Telenav, Inc., a leading provider of connected-car and location-based services, is proud to announce our number one position in market share among navigation engine suppliers with nearly 25% market share in North America in 2022, according to S&P Global Mobility’s (formerly IHS Markit) latest navigation engine supplier forecast. Some of the world’s largest automotive manufacturers including Ford Motor and GM rely on Telenav for location-based services including cloud-first navigation, EV routing, ADAS features, maps, and predictive services.

Telenav pioneered cloud-based navigation over 20 years ago, and we have been innovating ever since, combining Silicon Valley innovation with auto-grade reliability. As the world moves steadily towards EV adoption, the importance of EV-driving optimized navigation has grown in importance. Recently, Telenav has signed on several major Chinese EV manufacturers that are looking to expand their sales beyond China.

Among them are SAIC, XPENG and another major EV manufacturer that has yet be publicly disclosed. Similarly, a North American EV manufacturer is also using Telenav’s location services platform to enhance their customers’ driving experience.

“It is gratifying to learn that we have achieved this number one market share position”, said HP Jin, CEO of Telenav. “But our journey has only just begun in this new era of connected and software-defined vehicles, and we are excited about what the future holds for us, and more importantly, for our auto OEM partners”.

Toshiba New Power Devices

Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has launched new power devices, the “TWxxNxxxC series,” its 3rd generation silicon carbide(SiC) MOSFETs[1][2] that deliver low on-resistance and significantly reduced switching loss. Ten products, five 1200V and five 650V products, have started shipping today.

The new products reduce on-resistance per unit area (RDS(ON)A) by about 43%[3], allowing the drain-source on-resistance * gate-drain charge (RDS(ON)*Qgd), an important index that represents the relationship between conduction loss and switching loss, to be lowered by about 80%[4]. This cuts the switching loss by about 20%[5], and lowers both on-resistance and switching loss. The new products contribute to higher equipment efficiency.

Toshiba will continue to expand its lineup of power devices and to enhance its production facilities, and aims to realize a carbon-free economy by providing high-performance power devices that are easy to use.

[1] Toshiba has developed a device structure that reduces on-resistance per unit area (RDS(ON)A) by using a structure with built-in schottky barrier diode developed for the 2nd generation SiC MOSFETs, and also reduces feedback capacitance in the JFET region.
[2] MOSFET: metal-oxide-semiconductor field-effect transistor
[3] Comparison of the new 1200V SiC MOSFETs when RDS(ON)A is set to 1 in the 2nd generation SiC MOSFETs. Toshiba survey.
[4] Comparison of the new 1200V SiC MOSFETs when RDS(ON)*Qgd is set to 1 in the 2nd generation SiC MOSFETs. Toshiba survey.
[5] Comparison of the new 1200V SiC MOSFETs and the 2nd generation SiC MOSFETs. Toshiba survey.

・Switching power supplies (servers, data center, communications equipment, etc.)
・EV charging stations
・Photovoltaic inverters
・Uninterruptible power supplies (UPS)

Windbond Certification

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that they had received the ISO/SAE 21434 certification from TÜV NORD for Road vehicles Cybersecurity Management System (CSMS), making them the world’s first memory vendor to receive the ISO/SAE 21434 standard certification for Road vehicles Cybersecurity Management System (CSMS).

ISO/SAE 21434 standard protects vehicle and automotive security by specifying the requirements to make automotive systems more robust against cyber-attacks. It outlines the criteria needed during the concept, development, production, usage and decommissions of automotive systems. Many car manufacturers and their component suppliers make this stand mandatory to improve how cyber threats are managed significantly. The ISO/SAE 21434 standard applies to microcomputers and their components and requires the automotive industry to adapt devices capable of meeting this standard and providing the required protection against cyber threats.